Systems and devices for improved solder dispensing
AssigneeArtos Engineering Company
InventorMichael A. Kirst
Life of this patent
Estimating the term…
Abstract
Systems and methods for soldering a workpiece using a solder application system. A nozzle includes a plurality of walls and a floor that together define a nozzle reservoir for containing liquid solder. The plurality of walls also define a soldering region that is external to the nozzle reservoir. The plurality of walls in the soldering region define holes that are configured to dispense the liquid solder from the nozzle reservoir. The holes are configured such that the liquid solder dispensed therefrom merges into a combined stream and the workpiece is soldered when placed into the combined stream
Claims20
A nozzle for soldering a workpiece using a solder application system, the nozzle comprising:
- a plurality of walls and a floor that together define a nozzle reservoir for containing liquid solder filled up to a fill height therein, wherein the plurality of walls also define a soldering region that is external to the nozzle reservoir, wherein the plurality of walls in the soldering region define a plurality of holes that are each defined below the fill height and each configured to dispense a stream of the liquid solder from the nozzle reservoir;
- wherein when the liquid solder is filled up to at least the fill height, a head pressure is generated at each of the plurality of holes such that the stream of the liquid solder is dispensed therefrom;
- and
- wherein the nozzle is configured such that the workpiece is soldered when placed into the soldering region.
(canceled)
A method for making a nozzle for soldering a workpiece using a solder application system, the method comprising:
- arranging a plurality of walls and a floor to together define a nozzle reservoir for containing liquid solder from the solder application system, wherein the plurality of walls define a soldering region that is external to the nozzle reservoir and is configured to receive the workpiece;
- and
- defining a plurality of holes within the plurality of walls in the soldering region, wherein the plurality of holes are configured to dispense the liquid solder from the nozzle reservoir, wherein the nozzle is configured such that the workpiece is soldered when placed in the soldering region.
A solder application system for soldering a workpiece, the solder application system comprising:
- a solder pot for containing liquid solder;
- a nozzle configured to be filled up to a fill height with the liquid solder and to dispense the liquid solder for soldering the workpiece, wherein the nozzle comprises a plurality of walls and a floor, wherein the plurality of walls define a soldering region, and wherein the plurality of walls within the soldering region include a plurality of holes each defined below the fill height and each configured to dispense a flow of the liquid solder from the nozzle reservoir in a horizontal direction;
- and
- a pumping system for pumping the liquid solder from the solder pot to the nozzle;
- wherein when the liquid solder is filled up to at least the fill height, a head pressure is generated at each of the plurality of holes such that the stream of the liquid solder is dispensed therefrom;
- and
- wherein the plurality of holes are positioned such that the flow of the liquid solder dispensed therefrom merges into a combined stream in the soldering region such that the workpiece is soldered when placed into the combined stream.
Dependencies are inferred from the claim text.