Additive manufacturing of electronics having bulk properties

A method comprising:

• providing an electrically insulating substrate;
• depositing a quantity of first intermediary material onto the substrate in a pattern corresponding to a desired pattern of a first conductive structure;
• adhering the first intermediary material to the substrate to form a first intermediate layer on a portion of the substrate such that the first intermediate layer maintains the desired pattern of the first conductive structure;
• depositing a quantity of a precursor of a first electrically conductive material generally along the pattern of the first intermediate layer;
• and
• providing sufficient energy to at least the quantity of precursor of a first electrically conductive material to enable migration and consolidation of the first electrically conductive material along the pattern of the first intermediate layer, forming a functional, electrically conductive top layer;
• wherein at least one of the first electrically conductive material and its precursor has a wetting angle of less than 90° relative to the first intermediate layer, and a wetting angle greater than 90° relative to the substrate;
• and
• wherein at least one of the depositing steps is an additive deposition step.