Apparatus and Device to Function as an Electrical Lead Consisting of Electrodes for Neurological Stimulation and Signal Recording
AssigneeLsdm Labs, LLC
InventorsTerry Daglow, Joseph Johnnie, John Procter
Life of this patent
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Abstract
A device and method consisting of conductive, non-conductive, and support materials. These materials when dispensed or extruded onto a multitude of temporary structures will create an implantable conductive and non-conductive structure suitable for neurological electrical stimulation and neurological electrical recording. This structure may also be suitable for delivering fluid and/or contain optical structures suitable for physiological sensing.
Claims21
An implantable lead device for conducting electrical signals comprising:
- a. a distal end and a proximal end, wherein the lead device is formed by one or more homogeneous continuous conductive polymeric material elements supported by one or more segmented non-conductive polymeric materials;
- b. conductive and non-conductive polymeric materials arranged to create one or more isolated conductive pathways;
- c. isolated conductive pathways transitioning to one or more non-isolated conductive areas for electrical dispersion or electrical reception;
A method for fabricating an electrical conducting lead for electrical current generation and signal recording comprising the steps of:
- a. extruding through a depositing nozzle a polymeric material, either conductive, non-conductive, or alternatingly both conductive and non-conductive polymeric material, in an additive manufacturing process onto a moveable build substrate;
- b. firstly, depositing non-conductive extrusion polymeric material in such a form as to allow for a continuous, homogeneous initial application along the length of a substrate via a nozzle;
- c. moving said nozzle in orthogonal directions while rotating the substrate about one or more separate axes;
- d. positioning the substrate and adjusting the nozzle's rate of deposition, distance from substrate and position in relation to substrate as to allow each subsequent application to be placed immediately adjacent to or above or otherwise about the previous application as to form a contiguous structure;
- e. continuing the process until the polymeric material is adequately adhered to the substrate and/or adjacent polymeric segments either completely or partially;
- f. depositing of a second application of polymeric material adjacent to, radially, outwardly or otherwise contiguously adhered to said initial application in a similar manner as the initial application except that voids or gaps of equal size, unequal size, regularly or irregularly occurring sequential, non-sequential, repeating, non-repeating, patterns are created where no polymeric material exists;
- g. placing within these voids conductive polymeric material in a predominantly alternating format of sequential, non-sequential, repeating, non-repeating, sequential, and non-sequential patterns as to optimize the placement of conductive and non-conductive elements with no loss of electrical continuity and conduction;
- h. depositing of a third application of non-conductive polymeric material leaving voids where conductive polymeric material will be deposited;
- i. depositing of conductive polymeric material into the voids of application three wherein the resulting conductive material element is comprised of coiled, radial, longitudinal and/or other geometrical conformations;
- j. adhering an outer application of non-conductive polymeric material that is deposited to completely or incompletely cover remaining areas of the prior application not occupied by conductive polymeric material and to complete the outer dimension of the lead body;
- and
- k. removing electrical conducting lead from the build substrate.
Dependencies are inferred from the claim text.