Resin composition, adhesive layer, and circuit board utilizing same
AssigneesQing Ding Precision Electronics (Huaian) Co., Ltd, Avary Holding (Shenzhen) Co., Limited.
InventorsFU-YUN SHEN, CONG LEI, MING-JAAN HO, HSIAO-TING HSU
Life of this patent
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Abstract
A resin having thermal conductivity comprises a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight, a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight, a polyphenylene ether in 3 to 35 parts by weight; and a dendritic acrylate oligomer in 3 to 45 parts by weight. An adhesive layer and a circuit board using the resin composition are also described.
Claims15
A resin composition comprising:
- a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight;
- a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight;
- a polyphenylene ether in 3 to 35 parts by weight;
- and
- a dendritic acrylate oligomer in 3 to 45 parts by weight.
An adhesive layer formed by curing a resin composition, the resin composition comprising:
- a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight;
- a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight;
- a polyphenylene ether in 3 to 35 parts by weight;
- and
- a dendritic acrylate oligomer in 3 to 45 parts by weight.
A circuit board comprising at least one adhesive layer, each adhesive layer formed by curing a resin composition, the resin composition comprising:
- a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight;
- a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight;
- a polyphenylene ether in 3 to 35 parts by weight;
- and
- a dendritic acrylate oligomer in 3 to 45 parts by weight.
Dependencies are inferred from the claim text.