Resin composition for forming replica mold, replica mold and pattern forming method using said replica mold
AssigneeDaicel Corporation
InventorsHiroto MIYAKE, Kiyoharu TSUTSUMI
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Abstract
Provided is a resin composition capable of forming an imprint replica mold that enables easy removal of a residual layer and enables formation of high-accuracy patterns. The resin composition for replica mold formation includes (A) a thermoplastic or thermosetting resin, and (B) a compound. The resin (A) has a transmittance of light of 50% or more at one or more wavelengths from 200 to 450 nm. The compound (B) is capable of absorbing or scattering light at the wavelength(s). The compound (B) is present in a proportion of 0.5 to 50 parts by weight per 100 parts by weight of the resin (A). The resin (A) is preferably selected from olefinic resins and silicone resins.
Claims20
A resin composition for replica mold formation, the resin composition comprising:
- (A) a thermoplastic or thermosetting resin having a transmittance of light of 50% or more at one or more wavelengths from 200 to 450 nm;
- and
- (B) a compound capable of absorbing or scattering the light at the wavelength or wavelengths,
- the compound (B) being present in a proportion of 0.5 to 50 parts by weight per 100 parts by weight of the resin (A).
Dependencies are inferred from the claim text.