# US 2019/0320563 A1 · Electromagnetic shielding film and method for manufacturing same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0320563 A1 - Document ID: US20190320563A1 - Status: Published application - Kind: A1 - Application number: 16/021,308 - Filed: 2018-06-28 - Published: 2019-10-17 - Earliest claimed: 2018-04-12 - Assignees: Qing Ding Precision Electronics (Huaian) Co., Ltd; Avary Holding (Shenzhen) Co., Limited. - Applicants: Qing Ding Precision Electronics (Huaian) Co.,Ltd; Avary Holding (Shenzhen) Co., Limited. - Inventors: FU-YUN SHEN; MING-JAAN HO; HSIAO-TING HSU - Web page: https://patentgrep.com/patent/US20190320563A1 ## CPC - H05K 9/0084: {comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition} - H05K 9/0088: {comprising a plurality of shielding layers; combining different shielding material structure} - B32B 7/06: permitting easy separation - B32B 7/12: using interposed adhesives or interposed materials with bonding properties - B32B 27/065: {of foam} - B32B 27/281: {comprising polyimides} - B32B 27/34: comprising polyamides - C09J 9/02: Electrically-conducting adhesives - C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins - H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)} - H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)} - B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer - B32B 2255/205: Metallic coating - B32B 2255/28: Multiple coating on one surface - B32B 2307/212: Electromagnetic interference shielding - B32B 2307/54: Yield strength; Tensile strength - B32B 2307/7265: Non-permeable - B32B 2307/732: Dimensional properties - B32B 2307/748: Releasability - B32B 2457/08: PCBs, i.e. printed circuit boards - C08K 2003/0806: {Silver} - C08K 2003/085: {Copper} - C08L 2205/025: containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure - H05K 2201/0154: Polyimide - H05K 2201/035: Paste overlayer, i.e. conductive paste or solder paste over conductive layer - H05K 2201/0715: provided by an outer layer of PCB - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) ## Abstract A film shielding against electromagnetic interference comprises an insulating layer, a silver layer, and a conductive adhesive layer. The insulating layer is made of polyimide. The metal layer is formed on the insulating layer. The conductive adhesive layer is coated on the metal layer and is very thin but renders the film less prone to bubbling and rupturing when in place. ## Claims ### Claim 1 An electromagnetic shielding film comprising: a polyamide insulating layer; a silver layer, formed on the insulating layer; a conductive adhesive layer, wherein the conductive adhesive layer is coated on the silver layer. ### Claim 2 (depends on 1) The electromagnetic shielding film of claim 1, further comprising a copper layer, the copper layer is thicker than the silver layer. ### Claim 3 (depends on 1) The electromagnetic shielding film of claim 1, wherein the conductive adhesive layer comprises bisphenol A diglycidyl ether with a mass percentage between 9.8% and 10.5%, bisphenol S diglycidyl ether with a mass percentage between 4.54% and 4.86%, bisphenol F diglycidyl ether with a mass percentage between 2.27% and 2.43%, polyamide with a mass percentage between 7.11% and 7.62%, silver copper powder with a mass percentage between 48.6% and 6.83%, and silver strips with a mass percentage between 6.44% and 25.9%. ### Claim 4 (depends on 1) The electromagnetic shielding film of claim 1, wherein a thickness of the electromagnetic shielding film is between 13 and 75 microns, a thickness of the insulating layer is between 5 and 35 microns, a thickness of the metal layer is between 0.1 and 0.5 microns, a thickness of the conductive adhesive layer is between 8 and 40 microns. ### Claim 5 (depends on 1) The electromagnetic shielding film of claim 1, wherein the metal layer is formed on the insulating layer by any of electroplating, electroless plating or electrostatic adsorption. ### Claim 6 A method of manufacturing an electromagnetic shielding film, comprising: providing a first insulating layer, wherein the insulating layer is metallized to obtain a silver layer; painting a conductive adhesive on a surface of the metal layer to form a conductive adhesive layer. ### Claim 7 (depends on 6) The method of claim 6, further comprising: metallizing a copper layer on the surface of the metal layer to form a metal thick layer, after the step of forming the metal layer and before the step of forming the conductive adhesive layer. ### Claim 8 (depends on 6) The method of claim 6, wherein a silverized reagent of the silver layer is silver nanocrystals, and a main catalyst is nanosilver. ### Claim 9 (depends on 8) The method of claim 8, wherein the silverized reagent is silver ion, and the main catalysts are AgNO3, Ag(NH3)2NO3, AgClO4, AgOAc. ### Claim 10 (depends on 6) The method of claim 6, wherein the conductive adhesive layer comprises bisphenol A diglycidyl ether with a mass percentage of between 9.8% and 10.5%, bisphenol S diglycidyl ether with a mass percentage of between 4.54% and 4.86%, and a mass percentage of 2.27%. 2.43% of bisphenol F diglycidyl ether, polyamide with a mass percentage between 7.11% and 7.62%, silver copper powder with a mass percentage between 48.6% and 68.3%, and silver strips with a mass percentage between 6.44% and 25.9%.