# US 2019/0320554 A1 · Electronic circuit board and power conversion device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0320554 A1 - Document ID: US20190320554A1 - Status: Published application - Kind: A1 - Application number: 16/462,294 - Filed: 2017-11-29 - Published: 2019-10-17 - Earliest claimed: 2016-12-09 - Assignees: Mitsubishi Electric Corporation - Applicants: Mitsubishi Electric Corporation - Inventors: Koji NAKAJIMA; Yuji SHIRAKATA; Kenta FUJII; Shota SATO - Web page: https://patentgrep.com/patent/US20190320554A1 ## CPC - H01F 27/2804: {Printed windings} - H05K 7/2089: {for power electronics, e.g. for inverters for controlling motor} - H01F 27/22: Cooling by heat conduction through solid or powdered fillings - H01F 27/2809: {on stacked layers} - H01F 27/2819: {Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit} - H01F 30/06: characterised by the structure - H02M 3/28: using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC - H02M 3/335: using semiconductor devices only - H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections} - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H05K 1/165: {incorporating printed inductors} - H05K 1/181: associated with surface mounted components - H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)} - H05K 7/20927: {Liquid coolant without phase change} - H02M 1/0064: {Magnetic structures combining different functions, e.g. storage, filtering or transformation} - H02M 3/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections} - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - H05K 2201/086: for inductive purposes, e.g. printed inductor with ferrite core - H05K 2201/10409: Screws - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) ## Abstract In an electronic circuit board of a power conversion device or the like, heat interference between parts mounted on a multi-layer printed circuit board is suppressed in order to place the mounted parts close to each other. The mounted parts include a semiconductor element and a magnetic part formed by a coil pattern, which is made from a copper foil of the printed circuit board, and by a magnetic core. A screw fixing portions is placed in the surroundings of the semiconductor element and the coil pattern. A heat radiation pattern connected to the screw fixing portion is provided between and around the semiconductor element and the coil pattern when viewed from a direction perpendicular to a principal surface of the multi-layer printed circuit board. The screw fixing portion is connected to a cooler in a manner that gives the screw fixing portion heat conductance and electrical conductance. ## Claims ### Claim at position 1 1-9. (canceled) ### Claim 10 An electronic circuit board, comprising: a multi-layer printed circuit board having mounted thereon a magnetic part and semiconductor elements, the magnetic part being formed by a magnetic core and a coil pattern formed by a circuit pattern, and the semiconductor elements being connected to the circuit pattern; a cooler placed on an opposite side from a mounting surface of the multi-layer printed circuit board; an insulating member, which has heat conductance, and is placed between the multi-layer printed circuit board and the cooler; a plurality of screw fixing portions placed in surroundings of the coil pattern and the semiconductor elements to fix the multi-layer printed circuit board and the cooler together; and a heat radiation pattern placed between at least two out of the coil pattern and the semiconductor elements when viewed from a direction perpendicular to a principal surface of the multi-layer printed circuit board, wherein, when viewed from the direction perpendicular to the principal surface of the multi-layer printed circuit board, the semiconductor elements are each placed on a line segment that connects two screw fixing portions out of the plurality of screw fixing portions, wherein the heat radiation pattern, the screw fixing portion, and the cooler are directly connected in a manner that gives heat conductance and electrical conductance to the heat radiation pattern, the screw fixing portion, and the cooler. ### Claim 11 (depends on 10) The electronic circuit board according to claim 10, wherein the plurality of semiconductor elements are arranged so that one screw fixing portion out of the plurality of screw fixing portions serves as a reference for a line segment with which placement and positions of the plurality of semiconductor elements are determined. ### Claim 12 (depends on 10) The electronic circuit board according to claim 10, wherein a primary-side winding wire and a secondary-side winding wire of a transformer, which is the magnetic part, are formed by the coil pattern placed so as to overlap when viewed from the direction perpendicular to the principal surface of the multi-layer printed circuit board, and one end of one of the primary-side winding wire and the secondary-side winding wire that has a smaller number of turns is connected to the screw fixing portion, and is electrically connected to the cooler. ### Claim 13 (depends on 11) The electronic circuit board according to claim 11, wherein a primary-side winding wire and a secondary-side winding wire of a transformer, which is the magnetic part, are formed by the coil pattern placed so as to overlap when viewed from the direction perpendicular to the principal surface of the multi-layer printed circuit board, and one end of one of the primary-side winding wire and the secondary-side winding wire that has a smaller number of turns is connected to the screw fixing portion, and is electrically connected to the cooler. ### Claim 14 (depends on 10) The electronic circuit board according to claim 10, wherein one end of the coil pattern is connected to the screw fixing portion. ### Claim 15 (depends on 11) The electronic circuit board according to claim 11, wherein one end of the coil pattern is connected to the screw fixing portion. ### Claim 16 (depends on 12) The electronic circuit board according to claim 12, wherein one end of the coil pattern is connected to the screw fixing portion. ### Claim 17 (depends on 13) The electronic circuit board according to claim 13, wherein one end of the coil pattern is connected to the screw fixing portion. ### Claim 18 (depends on 10) The electronic circuit board according to claim 10, wherein, when viewed from the direction perpendicular to the principal surface of the multi-layer printed circuit board, the heat radiation pattern is placed also in surroundings of at least one of the coil pattern and the semiconductor elements. ### Claim 19 (depends on 10) The electronic circuit board according to claim 10, wherein, when viewed from the direction perpendicular to the principal surface of the multi-layer printed circuit board, the heat radiation pattern overlaps with the coil pattern, or with the circuit pattern connecting mounted parts to one another. ### Claim 20 An electronic circuit board, comprising: a multi-layer printed circuit board having mounted thereon a magnetic part and semiconductor elements, the magnetic part being formed by a magnetic core and a coil pattern formed by a circuit pattern, and the semiconductor elements being connected to the circuit pattern; a cooler placed on an opposite side from a mounting surface of the multi-layer printed circuit board; an insulating member, which has heat conductance, and is placed between the multi-layer printed circuit board and the cooler; a screw fixing portion placed in surroundings of the coil pattern and the semiconductor elements to fix the multi-layer printed circuit board and the cooler together; and a heat radiation pattern placed between at least two out of the coil pattern and the semiconductor elements when viewed from a direction perpendicular to a principal surface of the multi-layer printed circuit board, and disconnected to the coil pattern and the circuit pattern connected to the semiconductor elements, wherein the heat radiation pattern, the screw fixing portion, and the cooler are directly connected in a manner that gives heat conductance and electrical conductance to the heat radiation pattern, the screw fixing portion, and the cooler. ### Claim 21 (depends on 20) The electronic circuit board according to claim 20, wherein, when viewed from the direction perpendicular to the principal surface of the multi-layer printed circuit board, the heat radiation pattern is placed also in surroundings of at least one of the coil pattern and the semiconductor elements. ### Claim 22 (depends on 20) The electronic circuit board according to claim 20, wherein, when viewed from the direction perpendicular to the principal surface of the multi-layer printed circuit board, the heat radiation pattern overlaps with the coil pattern, or with the circuit pattern connecting mounted parts to one another. ### Claim 23 (depends on 10) A power conversion device, comprising the electronic circuit board of claim 10, wherein the power conversion device comprises, as the magnetic part, a step-up transformer or a step-down transformer and a smoothing choke coil, wherein the power conversion device comprises, as the semiconductor elements, a switching element connected to a primary side of the step-up transformer or the step-down transformer, and a rectifier element connected to a secondary side of the step-up transformer or the step-down transformer, and wherein the switching element, the step-up transformer or the step-down transformer, the rectifier element, and the smoothing choke coil are placed on the multi-layer printed circuit board in the stated order. ### Claim 24 (depends on 20) A power conversion device, comprising the electronic circuit board of claim 20, wherein the power conversion device comprises, as the magnetic part, a step-up transformer or a step-down transformer and a smoothing choke coil, wherein the power conversion device comprises, as the semiconductor elements, a switching element connected to a primary side of the step-up transformer or the step-down transformer, and a rectifier element connected to a secondary side of the step-up transformer or the step-down transformer, and wherein the switching element, the step-up transformer or the step-down transformer, the rectifier element, and the smoothing choke coil are placed on the multi-layer printed circuit board in the stated order. ### Claim 25 (depends on 10) A power conversion device, comprising the electronic circuit board of claim 10, wherein the power conversion device comprises, as the magnetic part, two step-down transformers and two smoothing choke coils, wherein the power conversion device comprises, as the semiconductor elements, a plurality of switching elements connected to a primary side of the two step-down transformers, and rectifier elements connected to a secondary side of the two step-down transformers, wherein primary-side winding wires of the two step-down transformers are connected in series, and a secondary-side circuit formed by secondary-side winding wires of the two step-down transformers, the rectifier elements, and the smoothing choke coils is connected in parallel, wherein, when viewed from a direction perpendicular to the principal surface of the multi-layer printed circuit board, the two step-down transformers are placed at center, the plurality of switching elements, the rectifier elements, and the smoothing choke coils are placed around the two step-down transformers, and the plurality of switching elements and the rectifier elements are arranged in a U shape, and wherein the screw fixing portions are arranged into a triangular lattice pattern around the two step-down transformers and around the plurality of switching elements, the rectifier elements, and the smoothing choke coils. ### Claim 26 (depends on 20) A power conversion device, comprising the electronic circuit board of claim 20, wherein the power conversion device comprises, as the magnetic part, two step-down transformers and two smoothing choke coils, wherein the power conversion device comprises, as the semiconductor elements, a plurality of switching elements connected to a primary side of the two step-down transformers, and rectifier elements connected to a secondary side of the two step-down transformers, wherein primary-side winding wires of the two step-down transformers are connected in series, and a secondary-side circuit formed by secondary-side winding wires of the two step-down transformers, the rectifier elements, and the smoothing choke coils is connected in parallel, wherein, when viewed from a direction perpendicular to the principal surface of the multi-layer printed circuit board, the two step-down transformers are placed at center, the plurality of switching elements, the rectifier elements, and the smoothing choke coils are placed around the two step-down transformers, and the plurality of switching elements and the rectifier elements are arranged in a U shape, and wherein the screw fixing portions are arranged into a triangular lattice pattern around the two step-down transformers and around the plurality of switching elements, the rectifier elements, and the smoothing choke coils.