# US 2019/0320550 A1 · Method for manufacturing an ultrathin heat dissipation structure

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2019/0320550 A1
- Document ID: US20190320550A1
- Status: Published application
- Kind: A1
- Application number: 16/455,971
- Filed: 2019-06-28
- Published: 2019-10-17
- Earliest claimed: 2016-05-09
- Assignees: Avary Holding (Shenzhen) Co., Limited.; HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.; Garuda Technology Co., Ltd.
- Applicants: Avary Holding (Shenzhen) Co., Limited.; HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.; Garuda Technology Co., Ltd
- Inventors: NING HOU; CONG LEI; BIAO LI; MING-JAAN HO
- Web page: https://patentgrep.com/patent/US20190320550A1

## CPC

- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- B21D 39/00: Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating ({joining mitred profiles B21D53/745; } riveting B21J; uniting components by forging or pressing to form integral members B21K25/00; welding B23K; press-fitting, force-fitting, or shrinking in general B23P11/00, B21D19/00; by adhesives F16B11/00 {; Connections as such F16L, F16B}); Tube expanders
- H05K 7/2029: {using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)}
- H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)}
- H10W 40/037: {Assembling together parts thereof}
- H10W 40/735: {by melting or evaporation of solids}
- H10W 40/251: {Organics}
- H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B21D: WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL (working or processing of wire B21F)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A method for manufacturing the ultrathin heat dissipation structure includes providing a copper clad sheet, the copper clad sheet comprising an insulation layer and a copper clad layer; stamping the copper clad sheet to form a plurality of containing grooves and a plurality of ribs around each of the plurality of containing grooves, the cooper clad layer is used as an inner surface of the containing groove and the insulation layer is then an outer surface of the containing groove; providing bond blocks on each of the plurality of ribs; infilling phase-change material into the containing grooves of the copper clad sheet; providing a cover, pressing the cover to the bond blocks, the cover is fixed with the copper clad sheet by the bond blocks, the cover seals the containing grooves, and the phase-change material is received in the containing grooves; and solidifying the bond blocks.

## Claims

### Claim 1

A method for manufacturing the ultrathin heat dissipation structure, the method comprising:
providing a copper clad sheet, the copper clad sheet comprising an insulation layer and a copper clad layer attached on the insulation layer;
stamping the copper clad sheet to form a plurality of containing grooves and a plurality of ribs around each of the plurality of containing grooves, and wherein the cooper clad layer provides as an inner surface of the containing groove and the insulation layer is then an outer surface of the containing groove, wherein the copper clad layer has a same surface area as a surface area of the insulation layer, and a cross-section shape of the inner surface of each containing groove is same as a cross-section shape of the outer surface of each containing groove;
providing bond blocks on each of the plurality of ribs;
infilling phase-change material into the containing grooves of the copper clad sheet;
providing a cover, pressing the cover to the bond blocks, wherein the cover is fixed with the copper clad sheet by the bond blocks, the cover seals the containing grooves, and the phase-change material is received in the containing grooves; and
solidifying the bond blocks.

### Claim 2 (depends on 1)

The method of claim 1, wherein the bond blocks comprise molten resin material doped with metal particles, the metal particles are selected from the group comprising tin, bismuth and any combination thereof.

### Claim 3 (depends on 2)

The method of claim 2, wherein a weight ratio of tin in the adhesive is in the range from approximately 37% to approximately 38%, a weight ratio of bismuth in the adhesive is in the range from approximately 51% to approximately 52%, and a weight ratio of molten resin in the adhesive is in the range from approximately 4% to approximately 6%.

### Claim 4 (depends on 1)

The method of claim 1, wherein before the step of providing bond blocks on each of the plurality of ribs, further comprising: processing an inner surface of each of the plurality of containing grooves, and forming micro-structures in an inner surface of each containing groove.

### Claim 5 (depends on 1)

The method of claim 1, wherein each of the plurality of containing grooves comprising a bottom wall and a side wall around the bottom wall, and the bottom wall is substantially a flat plane, an angle a between the side wall and the bottom wall is approximately between 90° and 180°, a thickness of the side wall is thin than a thickness of the bottom wall.

### Claim 6 (depends on 6)

The method of claim 6, wherein the cover is made of metal.

### Claim 7 (depends on 7)

The method of claim 7, wherein the cover is a copper foil or an aluminum foil.

### Claim 8 (depends on 1)

The method of claim 1, wherein a surface area of the copper clad layer is larger than a surface area of the insulation layer.

### Claim 9 (depends on 8)

The method of claim 8, wherein a surface area of the copper clad layer is two times of a surface area of the insulation layer, and the cover is formed by using the copper clad layer exposed by the insulation layer for being turned approximately 180 degree.