# US 2019/0320529 A1 · Circuit board pad resonance control system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0320529 A1 - Document ID: US20190320529A1 - Status: Published application - Kind: A1 - Application number: 15/951,593 - Filed: 2018-04-12 - Published: 2019-10-17 - Earliest claimed: 2018-04-12 - Assignees: Dell Products L.P. - Applicants: Dell Products L.P. - Inventors: Vasa Mallikarjun Goud; Chun-Lin Liao; Bhyrav M. Mutnury - Web page: https://patentgrep.com/patent/US20190320529A1 ## CPC - H05K 1/0242: {Structural details of individual signal conductors, e.g. related to the skin effect} - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/0228: {Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K1/0245)} - H05K 3/244: {Finish plating of conductors, especially of copper conductors, e.g. for pads or lands (selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3465)} - H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)} - H05K 1/0219: {Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors} - H05K 3/243: {characterised by selective plating, e.g. for finish plating of pads (selective plating for making the circuit pattern H05K3/108, H05K3/182)} - H05K 2201/09445: Pads for connections not located at the edge of the PCB, e.g. for flexible circuits - H05K 2201/099: Coating over pads, e.g. solder resist partly over pads - H05K 2201/10189: Non-printed connector - H05K 2201/1031: Surface mounted metallic connector elements - H05K 2203/0307: Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites - H05K 2203/072: Electroless plating, e.g. finish plating or initial plating - H05K 2203/0726: Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure - H05K 2203/171: Tuning, e.g. by trimming of printed components or high frequency circuits - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A circuit board pad resonance control system includes a board. A signal transmission line is included on the board. A plurality of connector pads are positioned on the board. A first connector pad receives the signal transmission line adjacent a first end of that connector pad. The first connector pad includes a mounting surface that mounts directly to a coupling element that is configured to couple a subsystem to the board, and reduces a resonance that is produced by an open portion of a signal transmission path that is created when the coupling element is directly mounted to the mounting surface of the first connector pad in a first orientation. In a specific example, the mounting surface may include a plurality of protrusions, a plated surface, and/or a mask that reduces the conductivity of the connector pad which reduces signal integrity issues due to resonance. ## Claims ### Claim 1 A circuit board pad resonance dampening system, comprising: a board; a signal transmission line included on the board; and a plurality of connector pads that are positioned on the board and that include: a first connector pad that receives the signal transmission line adjacent a first end of the first connector pad, wherein the first connector pad includes a mounting surface that is configured to: mount directly to a coupling element that is configured to couple a subsystem to the board; and reduce a resonance that is produced by an open portion of a signal transmission path that is created when the coupling element is directly mounted to the mounting surface of the first connector pad in a first orientation. ### Claim 2 (depends on 1) The system of claim 1, wherein the mounting surface is configured to lower a conductivity of the first connector pad to reduce a current flow that is present when a signal is applied to the first connector pad relative to a connector pad without the mounting surface. ### Claim 3 (depends on 1) The system of claim 1, wherein the mounting surface includes a plurality of protrusions. ### Claim 4 (depends on 3) The system of claim 3, wherein the plurality of protrusions provide a variation in the mounting surface between 20 micrometers and 50 micrometers. ### Claim 5 (depends on 1) The system of claim 1, wherein the plurality of connector pads include a second connector pad that is located adjacent the first connector pad such that no other connector pads are positioned between the first connector pad and the second connector pad, wherein the mounting surface is configured to reduce crosstalk coupling between the first connector pad and the second connector pad when a signal is transmitted to the first connector pad via the signal transmission line. ### Claim 6 (depends on 1) The system of claim 1, further comprising: a coupling element mounted to the first connector pad in the first orientation such that a connector lead portion included on the coupling element is positioned adjacent the first end of the first connector pad and a mounting portion of the coupling element extends away from the first end of the first connector pad and mounts to the mounting surface. ### Claim 7 (depends on 6) The system of claim 6, wherein the mounting surface includes a mask over at least a portion of the first connector pad and the mounting portion. ### Claim 8 An Information Handling System (IHS), comprising: a circuit board; a processing system mounted to the circuit board; a memory system mounted to the circuit board and coupled to the processing system through the circuit board; a signal transmission line included on the circuit board and coupled to the processing system; and a plurality of connector pads that are positioned on the circuit board and that include: a first connector pad that receives the signal transmission line adjacent a first end of the first connector pad, wherein the first connector pad includes a mounting surface that is configured to: mount directly to a coupling element that is configured to couple a subsystem to the circuit board; and reduce a resonance that is produced by an open portion of a signal transmission path that is created when the coupling element is directly mounted to the mounting surface of the first connector pad in a first orientation. ### Claim 9 (depends on 8) The IHS of claim 8, wherein the mounting surface is configured to lower a conductivity of the first connector pad to reduce a current flow that is present when a signal is applied to the first connector pad relative to a connector pad without the mounting surface. ### Claim 10 (depends on 8) The IHS of claim 8, wherein the mounting surface includes a plurality of protrusions. ### Claim 11 (depends on 10) The IHS of claim 10, wherein the plurality of protrusions provide a variation in the mounting surface between 20 micrometers and 50 micrometers. ### Claim 12 (depends on 8) The IHS of claim 8, wherein the plurality of connector pads include a second connector pad that is located adjacent the first connector pad such that no other connector pads are positioned between the first connector pad and the second connector pad, wherein the mounting surface is configured to reduce crosstalk coupling between the first connector pad and the second connector pad when a signal is transmitted to the first connector pad via the signal transmission line. ### Claim 13 (depends on 8) The IHS of claim 8, further comprising: a coupling element mounted to the first connector pad in the first orientation such that a connector lead portion included on the coupling element is positioned adjacent the first end of the first connector pad and a mounting portion of the coupling element extends away from the first end of the first connector pad and mounts to the mounting surface. ### Claim 14 (depends on 13) The IHS of claim 13, wherein the mounting surface includes a mask over at least a portion of the first connector pad and the mounting portion. ### Claim 15 A method for controlling resonance on a circuit board connector pad, comprising: providing, on a board, a first connector pad that includes a first end; routing, on the board, a signal transmission line such that the signal transmission line is received adjacent the first end of the first connector pad; and providing a mounting surface on the first connector pad that is configured to mount directly to a coupling element that is configured to couple a subsystem to the board, and reduce a resonance that is produced by an open portion of a signal transmission path that is created when the coupling element is directly mounted to the mounting surface of the first connector pad in a first orientation. ### Claim 16 (depends on 15) The method of claim 15, wherein the mounting surface is configured to lower a conductivity of the first connector pad to reduce a current flow that is present when a signal is applied to the first connector pad relative to a connector pad without the mounting surface. ### Claim 17 (depends on 15) The method of claim 15, further comprising: forming a plurality of protrusions on the mounting surface. ### Claim 18 (depends on 15) The method of claim 15, further comprising: forming a plated mounting surface on the mounting surface, wherein the plated mounting surface includes a conductivity that is less than the conductivity of the first connector pad. ### Claim 19 (depends on 15) The method of claim 15, further comprising: coupling a coupling element to the first connector pad in the first orientation such that a connector lead portion included on the coupling element is positioned adjacent the first end of the first connector pad and a mounting portion of the coupling element extends away from the first end of the first connector pad and mounts to the mounting surface. ### Claim 20 (depends on 19) The method of claim 19, further comprising: forming a mask over at least a portion of the first connector pad and the mounting portion.