# US 2019/0319213 A1 · Display device and method of fabricating display device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0319213 A1 - Document ID: US20190319213A1 - Status: Published application - Kind: A1 - Application number: 16/376,187 - Filed: 2019-04-05 - Published: 2019-10-17 - Earliest claimed: 2018-04-16 - Assignees: Samsung Display Co., Ltd. - Applicants: Samsung Display Co., Ltd. - Inventors: Euiyun JANG; Cheolgeun AN; Wonjoon CHOI; Jeongho HWANG - Web page: https://patentgrep.com/patent/US20190319213A1 ## CPC - H10K 59/87: {Passivation; Containers; Encapsulations} - H10K 59/8722: {Peripheral sealing arrangements, e.g. adhesives, sealants} - H10K 59/131: Interconnections, e.g. wiring lines or terminals - H10K 59/40: OLEDs integrated with touch screens - H10K 59/8791: {Arrangements for improving contrast, e.g. preventing reflection of ambient light} - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract A display device includes: a display panel including a display region and a non-display region; a window member on the display panel; and an adhesive member between the display panel and the window member. The adhesive member includes: a first adhesion portion overlapping the display region, and a second adhesion portion extending from the first adhesion portion and overlapping the non-display region. The display panel includes: a substrate, a display element layer on the substrate and overlapping the display region, a driving chip on the substrate and overlapping the non-display region, and an encapsulation member on the display element layer. The driving chip is configured to provide a driving signal to the display element layer. The first adhesion portion connects the window member to the encapsulation member. The second adhesion portion connects the window member to the substrate and encloses the driving chip, but does not overlap the driving chip. ## Claims ### Claim 1 A display device, comprising: a display panel comprising a display region and a non-display region; a window member on the display panel; and an adhesive member between the display panel and the window member, the adhesive member comprising: a first adhesion portion overlapping with the display region in a plan view; and a second adhesion portion extending from the first adhesion portion and overlapping with the non-display region in the plan view, wherein the display panel comprises: a substrate; a display element layer on the substrate and overlapping with the display region; a driving chip on the substrate and overlapping with the non-display region, the driving chip being configured to provide a driving signal to the display element layer; and an encapsulation member on the display element layer, wherein the first adhesion portion connects the window member to the encapsulation member, and wherein the second adhesion portion connects the window member to the substrate, the second adhesion portion enclosing the driving chip, but not overlapping with the driving chip in the plan view. ### Claim 2 (depends on 1) The display device of claim 1, wherein: the first adhesion portion is in contact with a top surface of the encapsulation member; and the second adhesion portion is in contact with a side surface of side surfaces of the encapsulation member, the side surface being adjacent to the driving chip, the second adhesion portion being in contact with a portion of the top surface. ### Claim 3 (depends on 1) The display device of claim 1, wherein: the display panel further comprises pads electrically connected to the driving chip, the pads being on the substrate; and the non-display region comprises: a chip region, the driving chip being on the chip region; and a pad region, the pads being on the pad region. ### Claim 4 (depends on 3) The display device of claim 3, wherein, when viewed in the plan view, the second adhesion portion does not overlap with either of the chip region and the pad region. ### Claim 5 (depends on 3) The display device of claim 3, wherein: the pads are farther from the display region than the driving chip; and when viewed in the plan view, the second adhesion portion overlaps with a region between the chip region and the pad region. ### Claim 6 (depends on 1) The display device of claim 1, further comprising: a polarization member on the encapsulation member and overlapping with the display region, wherein the first adhesion portion comprises: a first portion connecting the polarization member to the window member; and a second portion extending from the first portion and connecting a portion of a top surface of the encapsulation member to the window member. ### Claim 7 (depends on 1) The display device of claim 1, wherein, when viewed in the plan view, the second adhesion portion is spaced apart from the driving chip. ### Claim 8 (depends on 1) The display device of claim 1, further comprising: an input sensing unit on the encapsulation member; and a circuit board on the encapsulation member, the circuit board being configured to provide a sensing driving signal to the input sensing unit. ### Claim 9 (depends on 8) The display device of claim 8, wherein, when viewed in the plan view, the second adhesion portion does not overlap with the circuit board. ### Claim 10 A display device, comprising: a display panel comprising a display region and a non-display region; a window member on the display panel; and an adhesive member between the display panel and the window member, the adhesive member comprising: a first adhesion portion overlapping with the display region in a plan view; and a second adhesion portion extending from the first adhesion portion and overlapping with the non-display region in the plan view, wherein the display panel comprises: a substrate; a display element layer on the substrate and overlapping with the display region; and an encapsulation member on the display element layer, wherein the first adhesion portion connects the window member to the encapsulation member, and wherein the second adhesion portion is spaced apart from the substrate and is connected to the window member. ### Claim 11 (depends on 10) The display device of claim 10, wherein, in a thickness direction of the display panel, a thickness of the second adhesion portion is greater than a thickness of the first adhesion portion. ### Claim 12 (depends on 10) The display device of claim 10, wherein the display panel further comprises a driving chip on the substrate and overlapping with the non-display region, the driving chip being configured to provide a driving signal to the display element layer. ### Claim 13 (depends on 12) The display device of claim 12, wherein the second adhesion portion does not contact the driving chip. ### Claim 14 (depends on 12) The display device of claim 12, wherein the second adhesion portion contacts a top surface of the driving chip, but does not contact side surfaces of the driving chip. ### Claim 15 (depends on 12) The display device of claim 12, wherein: the display panel further comprises pads on the substrate and electrically connected to the driving chip; and the second adhesion portion does not contact the pads. ### Claim 16 A method of fabricating a display device, the method comprising: forming, using an inkjet printer, an adhesive member on a window member; coupling, using the adhesive member, the window member to a display panel; and irradiating the adhesive member with ultraviolet light to harden the adhesive member, wherein the display panel comprises a display region and a non-display region, wherein the adhesive member comprises: a first adhesion portion overlapping with the display region; and a second adhesion portion extending from the first adhesion portion and overlapping with the non-display region, and wherein the inkjet printer is configured to form the second adhesion portion on the window member such that a thickness of the second adhesion portion is greater than a thickness of the first adhesion portion. ### Claim 17 (depends on 16) The method of claim 16, wherein: the display panel comprises: a substrate; a display element layer on the substrate and overlapping with the display region; and an encapsulation member on the display element layer; and the second adhesion portion is formed on the window member such that the second adhesion portion is spaced apart from the substrate. ### Claim 18 (depends on 17) The method of claim 17, wherein: the first adhesion portion contacts a top surface of the encapsulation member; and the second adhesion portion contacts a side surface of the encapsulation member. ### Claim 19 (depends on 16) The method of claim 16, wherein forming the adhesive member on the window member comprises: ejecting an adhesive material onto the window member using the inkjet printer; and irradiating the ejected adhesive material with ultraviolet light to harden the ejected adhesive material. ### Claim 20 (depends on 16) The method of claim 16, wherein the adhesive member is an optically clear resin.