# US 2019/0319085 A1 · 3-dimensional printing process for integrated magnetics

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- Number: US 2019/0319085 A1
- Document ID: US20190319085A1
- Status: Published application
- Kind: A1
- Application number: 16/454,602
- Filed: 2019-06-27
- Published: 2019-10-17
- Earliest claimed: 2017-03-29
- Assignees: Globalfoundries Singapore Pte. Ltd.
- Applicants: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Inventors: Lulu PENG; Donald Ray DISNEY; Lawrence Selvaraj SUSAI; Rajesh Sankaranarayanan NAIR
- Web page: https://patentgrep.com/patent/US20190319085A1

## CPC

- H10D 1/20: Inductors
- B22F 10/28: Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
- B23K 15/0086: {welding for purposes other than joining, e.g. build-up welding}
- B23K 15/0093: {characterised by the properties of the materials to be welded}
- B23K 26/0006: {taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence)}
- B23K 26/082: Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K 26/0876: {in at least two axial directions}
- B23K 26/342: Build-up welding
- B29C 64/153: using layers of powder being selectively joined, e.g. by selective laser sintering or melting
- B33Y 10/00: Processes of additive manufacturing
- B33Y 80/00: Products made by additive manufacturing
- C23C 24/106: {Coating with metal alloys or metal elements only}
- H01F 17/0006: {Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K)}
- H01F 17/0013: {with stacked layers}
- H01F 17/0033: {with the coil helically wound around a magnetic core}
- H01F 41/046: {structurally combined with ferromagnetic material}
- H01F 41/16: the magnetic material being applied in the form of particles, e.g. by serigraphy {, to form thick magnetic films or precursors therefor} (H01F41/18 {-H01F41/24} take precedence)
- H01F 41/22: Heat treatment; Thermal decomposition; Chemical vapour deposition
- H10P 14/412: {Deposition of metallic or metal-silicide materials}
- H10W 20/497: {Inductive arrangements or effects of, or between, wiring layers}
- B22F 10/32: of the atmosphere, e.g. composition or pressure in a building chamber
- B22F 2998/10: Processes characterised by the sequence of their steps
- B23K 2101/40: Semiconductor devices
- B23K 2101/42: Printed circuits
- B23K 2103/12: Copper or alloys thereof
- B23K 2103/172: {wherein at least one of the layers is non-metallic}
- B29K 2079/08: {PI, i.e. polyimides or derivatives thereof}
- B29K 2995/0006: Dielectric
- B29K 2995/0008: Magnetic or paramagnetic
- B29L 2031/34: Electrical apparatus, e.g. sparking plugs or parts thereof
- C22C 2202/02: Magnetic
- H01F 2017/0066: {with a magnetic layer}
- Y02P 10/25: Process efficiency
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B33Y: ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- C22C: ALLOYS (treatment of alloys C21D, C22F)
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

Integrated circuits (ICs) and method for forming IC devices are presented. In one embodiment, a method of forming a device with an integrated magnetic component using 3-dimensional (3-D) printing is disclosed. The method includes providing a substrate with a base dielectric layer, the base dielectric layer serves as a base for the integrated magnetic component. A first metal layer is formed on the substrate by spray coating metal powder over the substrate and performing selective laser melting on the metal powder. A magnetic core is formed on the substrate by spray coating magnet powder over the substrate and performing selective laser sintering on the magnet powder. A second metal layer is formed on the substrate by spray coating metal powder over the substrate and performing selective laser melting on the metal powder. A patterned dielectric layer separates the first and second metal layers and the magnetic core.

## Claims

### Claim 1

A method of forming a device with an integrated magnetic component using three-dimensional printing, the method comprising:
providing a substrate with a first dielectric layer;
forming a first layer of a metal winding on the first dielectric layer by spray coating a metal powder over the first dielectric layer and selective laser sintering the metal powder;
forming a second dielectric layer over the first layer of the metal winding and the first dielectric layer;
patterning the second dielectric layer to include a first plurality of openings extending to the first layer of the metal winding;
forming a magnetic core on the second dielectric layer by spray coating a magnetic powder over the second dielectric layer and selective laser sintering the magnetic powder;
forming a third dielectric layer over the magnetic core and the second dielectric layer;
patterning the third dielectric layer to include a second plurality of openings connected with the first plurality of openings; and
forming a second layer of the metal winding on the third dielectric layer by spray coating a metal powder over the substrate and selective laser sintering the metal powder,
wherein the second dielectric layer and the third dielectric layer insulate the first and second layers of the metal winding from the magnetic core, and the spray coating of the metal powder of the second layer of the metal winding fills the first plurality of openings and the second plurality of openings such that, after selective layer sintering, the first and second layers of the metal winding are interconnected and surround the magnetic core.

### Claim 2 (depends on 1)

The method of claim 1 wherein the second dielectric layer is formed over the first layer of the metal winding by spray coating a dielectric polymer powder over the first layer of the metal winding and performing selective laser exposure and curing on the dielectric polymer powder.

### Claim 3 (depends on 2)

The method of claim 2 wherein the third dielectric layer is formed over the magnetic core and the second dielectric layer by spray coating a dielectric polymer powder over the magnetic core and the second dielectric layer and performing selective laser exposure and curing on the dielectric polymer powder.

### Claim 4 (depends on 3)

The method of claim 3 wherein the thickness of the dielectric polymer powder for forming the second dielectric layer and the third dielectric layer is about 10 μm.

### Claim 5 (depends on 1)

The method of claim 1 wherein the first dielectric layer comprises silicon oxide, and the second dielectric layer and the third dielectric layer each comprise polyimide or benzocyclobutene.

### Claim 6 (depends on 1)

The method of claim 1 wherein the first dielectric layer comprises silicon oxide, and the second dielectric layer comprises polyimide or benzocyclobutene.

### Claim 7 (depends on 1)

The method of claim 1 wherein the magnetic powder and the metal powder are spray coated in a sealed chamber with a vacuum or inert environment.

### Claim 8 (depends on 1)

The method of claim 1 wherein selective laser sintering the metal powder comprises:
scanning a high powered laser beam to selectively scan and fuse the metal powder.

### Claim 9 (depends on 1)

The method of claim 1 wherein selective laser sintering the magnetic powder comprises:
scanning a high powered laser beam to selectively scan and fuse the magnetic powder.

### Claim 10 (depends on 1)

The method of claim 1 wherein the device has a toroidal shape.

### Claim 11 (depends on 1)

The method of claim 1 wherein the metal powder and the magnetic powder that are spray coated comprise gas atomized powders.

### Claim 12 (depends on 1)

The method of claim 1 wherein the metal powder for forming the first layer and the second layer of the metal winding is about 20 μm.

### Claim 13 (depends on 1)

The method of claim 1 wherein the thickness of the magnetic powder for forming the magnetic core is about 10 μm.

### Claim 14 (depends on 1)

The method of claim 1 wherein the magnetic core comprises nickel, cobalt, an iron-based alloy, or a combination thereof, and the metal winding comprises copper or a copper-aluminum alloy.

### Claim 15

A structure comprising:
a substrate including a first dielectric layer, a second dielectric layer over the first dielectric layer, and a third dielectric layer over the second dielectric layer;
a magnetic core on the second dielectric layer; and
a metal winding including first layer on the first dielectric layer and a second layer on the third dielectric layer,
wherein the second dielectric layer includes a first plurality of openings extending to the first layer of the metal winding, the third dielectric layer includes a second plurality of openings connected with the first plurality of openings, the second dielectric layer and the third dielectric layer insulate the first and second layers of the metal winding from the magnetic core, the metal winding includes portions in the first plurality of openings and the second plurality of openings, and the portions of the metal winding interconnect the first and second layers of the metal winding such that the metal winding surrounds the magnetic core.

### Claim 16 (depends on 15)

The structure of claim 15 wherein the magnetic core and the first and second layers of the metal winding have a toroidal shape.

### Claim 17 (depends on 15)

The structure of claim 15 wherein the first dielectric layer comprises silicon oxide, and the second dielectric layer and the third dielectric layer each comprise polyimide or benzocyclobutene.

### Claim 18 (depends on 15)

The structure of claim 15 wherein the first dielectric layer comprises silicon oxide, and the second dielectric layer comprises polyimide or benzocyclobutene.

### Claim 19 (depends on 15)

The structure of claim 15 wherein the magnetic core comprises nickel, cobalt, an iron-based alloy, or a combination thereof, and the metal winding comprises copper or a copper-aluminum alloy.

### Claim 20 (depends on 15)

The structure of claim 15 wherein the first layer and the second layer of the metal winding each have a thickness of about 20 μm, and the magnetic core has a thickness of about 10 μm.