# US 2019/0318982 A1 · Electronic device and connector

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- Number: US 2019/0318982 A1
- Document ID: US20190318982A1
- Status: Published application
- Kind: A1
- Application number: 16/466,619
- Filed: 2017-02-20
- Published: 2019-10-17
- Earliest claimed: 2017-02-20
- Assignees: Shidengen Electric Manufacturing Co., Ltd.
- Applicants: Shidengen Electric Manufacturing Co., Ltd.
- Inventors: Soichiro UMEDA; Yuji MORINAGA
- Web page: https://patentgrep.com/patent/US20190318982A1

## CPC

- H10W 70/427: {Bent parts}
- H10W 70/466: {Tape carriers or flat leads}
- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H10W 70/048: {Mechanical treatments, e.g. punching, cutting, deforming or cold welding}
- H10W 70/468: {Circuit boards}
- H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00}
- H10W 90/811: {Multiple chips on leadframes}
- H10W 70/417: {Bonding materials between chips and die pads}
- H10W 70/424: {Cross-sectional shapes (H10W70/481 takes precedence)}
- H10W 72/07353: {changes in shapes}
- H10W 72/07354: {changes in dispositions}
- H10W 72/076: {of strap connectors}
- H10W 72/07636: {Soldering or alloying}
- H10W 72/07653: {changes in shapes}
- H10W 72/334: {Cross-sectional shape, i.e. in side view}
- H10W 72/347: {Dispositions of multiple die-attach connectors}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/387: {Flow barriers}
- H10W 72/551: {Materials of bond wires}
- H10W 72/631: {Shapes of strap connectors}
- H10W 72/634: {Cross-sectional shape}
- H10W 72/646: {the connected ends being on auxiliary connecting means on bond pads, e.g. on a bump connector}
- H10W 72/871: {Bond wires and strap connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/886: {Die-attach connectors and strap connectors}
- H10W 72/926: {Multiple bond pads having different sizes}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/764: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/766: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic device has a sealing part 90, an electronic element 95 provided in the sealing part 90, a first terminal that projects outward from the sealing part 90 and a connector 51 that has a head part 40 connected to a front surface of the electronic element 95 via a conductive adhesive 75, and a proximal end part 45 connected to the first terminal via a conductor layer 75. The head part 40 has a single first projection part 41 that projects toward the electronic element 95. The first projection part 41 sinks into the conductive adhesive 75 and comes into point contact with the front surface of the electronic element 95. The proximal end part 45 has a plurality of protrusion parts 49 or a support surface 46, contacting the conductor layer 70.

## Claims

### Claim 1

An electronic device comprising:
a sealing part;
an electronic element provided in the sealing part;
a first terminal that projects outward from the sealing part; and
a connector that has a head part connected to a front surface of the electronic element via a conductive adhesive, and a proximal end part connected to the first terminal via a conductor layer, wherein
the head part has a single first projection part that projects toward the electronic element,
the first projection part sinks into the conductive adhesive, and comes into point contact with the front surface of the electronic element, and
the proximal end part has a plurality of protrusion parts or a support surface.

### Claim 2 (depends on 1)

The electronic device according to claim 1, wherein
the proximal end part is connected to the conductor layer via a conductive adhesive,
the proximal end part has the support surface and a recess part provided at a circumferential edge of the support surface.

### Claim 3 (depends on 2)

The electronic device according to claim 2, wherein
the proximal end part has a bent part which extends while bent toward a front surface side, and
the recess part extends toward the front surface side at least to the bent part.

### Claim 4 (depends on 1)

The electronic device according to claim 1, wherein
the head part has a second projection part which projects toward the electronic element, and
the first projection part projects toward the electronic element from the second projection part.

### Claim 5 (depends on 4)

The electronic device according to claim 4, wherein
the proximal end part has the support surface, and
assuming that a line connecting a center of the proximal end part in a width direction and a center of the head part in a width direction is a first direction, a length of the support surface in the first direction is smaller than a length of the second projection in the first direction.

### Claim 6 (depends on 1)

The electronic device according to claim 1, wherein
the first projection part is positioned at a center of the head part in a width direction.

### Claim 7 (depends on 1)

The electronic device according to claim 1, wherein
the first projection part has a linear part positioned on a base side of the first projection part and having a linear vertical cross-sectional shape, and a hemispherical shape part positioned on a tip end side of the linear part and having a hemispherical or circular-arc vertical cross-sectional shape.

### Claim 8

A connector used for an electronic device having a sealing part, an electronic element provided in the sealing part and a first terminal that projects outward from the sealing part, the connector comprising:
a head part connected to a front surface of the electronic element via a conductive adhesive; and
a proximal end part connected to the first terminal via a conductor layer, wherein
the head part has a single first projection part that projects toward the electronic element,
the first projection part sinks into the conductive adhesive, and comes into point contact with the front surface of the electronic element, and the proximal end part has a plurality of protrusion parts contacting with the conductor layer or a support surface contacting with the conductor layer.