# US 2019/0318981 A1 · Semiconductor device

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- Number: US 2019/0318981 A1
- Document ID: US20190318981A1
- Status: Published application
- Kind: A1
- Application number: 16/375,976
- Filed: 2019-04-05
- Published: 2019-10-17
- Earliest claimed: 2018-04-12
- Assignees: Toyota Jidosha Kabushiki Kaisha
- Applicants: Toyota Jidosha Kabushiki Kaisha
- Inventors: Yuya TAKANO; Fumiki TANAHASHI
- Web page: https://patentgrep.com/patent/US20190318981A1

## CPC

- H10W 40/611: {Bolts or screws}
- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 40/613: {for stacked arrangements of a plurality of semiconductor devices}
- H10W 40/235: {attached to package parts}
- H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W 90/00: Package configurations
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor device may include coolers, semiconductor modules, and a pair of connecting pipes. The coolers are arranged in a line and each of which includes a first flow path. Each of the semiconductor modules is interposed between a corresponding pair of the coolers. Each of the connecting pipes communicates with the adjacent coolers. A pair of coolant holes may be provided at one of the coolers located at one end in the stacking direction. A pair of second flow paths may extend respectively from the coolant holes to one of the coolers located at other end in the stacking direction. A bolt-head retainer and an internally threaded portion may be provided in each second flow path, the bolt-head retainer retaining a head of a bolt, and the internally threaded portion fixing the bolt. The coolers between the bolt-lead retainers and the internally threaded portions are fixed by the bolts.

## Claims

### Claim 1

A semiconductor device comprising:
a plurality of coolers arranged in a line, each of the coolers including a first flow path;
semiconductor modules, each of the semiconductor modules being interposed between a corresponding pair of the coolers adjacent to each other; and
a pair of connecting pipes, each, of the pair of connecting pipes communicating with the coolers adjacent to each other, the pair of connecting pipes located respectively at both sides of the semiconductor modules in a direction intersecting a stacking direction of the coolers and the semiconductor modules,
wherein
a pair of coolant holes is provided at one of the coolers located at one end in the stacking direction,
each of the coolant holes overlaps corresponding one of the pair of the connecting pipes in a view along the stacking direction,
a pair of second flow paths extends respectively from the coolant holes to one of the coolers located at other end in the stacking direction,
a bolt-head retainer and an internally threaded portion are provided in each of the second flow paths, the bolt-head retainer retaining a head of a bolt, and the internally threaded portion fixing the bolt, and
the coolers between the bolt-head retainers and the internally threaded portions are fixed by the bolts.

### Claim 2 (depends on 1)

The semiconductor device of claim 1, wherein all of the coolers are fixed by the bolts.

### Claim 3 (depends on 1)

The semiconductor device of claim 1, wherein a compressed spring is interposed between each of the bolt-head retainers and corresponding one of the heads of the bolts.