# US 2019/0318974 A1 · Circuit module and method of manufacturing the same

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- Number: US 2019/0318974 A1
- Document ID: US20190318974A1
- Status: Published application
- Kind: A1
- Application number: 16/451,825
- Filed: 2019-06-25
- Published: 2019-10-17
- Earliest claimed: 2016-12-27
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Murata Manufacturing Co., Ltd.
- Inventors: Katsuhiko FUJIKAWA; Shingo FUNAKAWA; Kazushige SATO; Nobumitsu AMACHI
- Web page: https://patentgrep.com/patent/US20190318974A1

## CPC

- H10W 74/10: characterised by their shape or disposition
- H10W 74/114: {by a substrate and the encapsulations}
- H05K 3/36: Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)}
- H10W 40/10: Arrangements for heating
- H10W 40/228: {the projecting parts being wire-shaped or pin-shaped}
- H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
- H10W 40/778: {in encapsulations}
- H10W 70/40: Leadframes
- H10W 70/411: {Chip-supporting parts, e.g. die pads}
- H10W 70/461: {specially adapted for cooling}
- H10W 74/40: characterised by their materials
- H10W 90/00: Package configurations
- H10W 90/811: {Multiple chips on leadframes}
- H05K 2201/10378: Interposers
- H05K 2201/10621: Components characterised by their electrical contacts
- H05K 2201/2018: Presence of a frame in a printed circuit or printed circuit assembly
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A circuit module (301) includes a first substrate (201), a first module (101), a sealing resin portion (3), and a conductive material film (7). The first substrate (201) has a first principal surface (201a). The first module (101) is mounted on the first principal surface (201a). The sealing resin portion (3) is formed on the first principal surface (201a) and covers the first module (101). The conductive material film (7) covers a side of the sealing resin portion (3). The first module (101) includes a conductive material portion and a device which may produce heat and which is mounted on the conductive material portion. The conductive material portion connects with the conductive material film (7) on the side of the sealing resin portion (3).

## Claims

### Claim 1

A circuit module comprising:
a first substrate having a first principal surface;
a first module mounted on the first principal surface;
a sealing resin portion provided on the first principal surface and covering the first module; and
a conductive material film covering a side of the sealing resin portion,
wherein the first module includes a conductive material portion, and a device capable of producing heat and mounted on the conductive material portion, and
wherein the conductive material portion is connected to the conductive material film on the side of the sealing resin portion.

### Claim 2 (depends on 1)

The circuit module according to claim 1,
wherein the first module has an insulated substrate, and
wherein the conductive material portion includes a conductor pattern disposed on a surface of the insulated substrate.

### Claim 3 (depends on 1)

The circuit module according to claim 1,
wherein the conductive material portion includes a lead frame.

### Claim 4 (depends on 3)

The circuit module according to claim 3,
wherein the conductive material portion includes a bent portion extending along the side of the sealing resin portion, and
wherein the bent portion is connected to the conductive material film.

### Claim 5

A method for manufacturing a circuit module, comprising:
a step of preparing a first substrate including a first principal surface;
a step of preparing a first module, the first module including a conductive material portion, and a device capable of producing heat and mounted on the conductive material portion;
a step of mounting the first module on the first principal surface;
a step of forming a sealing resin portion on the first principal surface in such a manner that the sealing resin portion covers the first module;
a step of exposing a cross section of the conductive material portion on a side of the sealing resin portion while a portion of the sealing resin portion is removed; and
a step of forming a conductive material film in such a manner that the conductive material film covers the side of the sealing resin portion, and thus obtaining a structure having the exposed cross section of the conductive material portion connected to the conductive material film on the side of the sealing resin portion.

### Claim 6 (depends on 5)

The method for manufacturing a circuit module, according to claim 5,
wherein the first module has an insulated substrate, and
wherein the conductive material portion includes a conductor pattern disposed on a surface of the insulated substrate.

### Claim 7 (depends on 5)

The method for manufacturing a circuit module, according to claim 5,
wherein the conductive material portion includes a lead frame.