# US 2019/0318954 A1 · Substrate processing apparatus and substrate holding apparatus

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- Number: US 2019/0318954 A1
- Document ID: US20190318954A1
- Status: Published application
- Kind: A1
- Application number: 16/381,507
- Filed: 2019-04-11
- Published: 2019-10-17
- Earliest claimed: 2018-04-16
- Assignees: Ebara Corporation
- Applicants: Ebara Corporation
- Inventors: Kenichi KOBAYASHI; Tetsuji TOGAWA
- Web page: https://patentgrep.com/patent/US20190318954A1

## CPC

- B24B 37/30: for single side lapping of plane surfaces
- B08B 1/165: {Scrapers}
- B08B 1/30: by movement of cleaning members over a surface
- B08B 1/36: rotating about an axis orthogonal to the surface
- B24B 41/067: {radially supporting workpieces}
- H10P 72/0414: {using mainly spraying means, e.g. nozzles}
- H10P 72/0472: {comprising at least one polishing chamber}
- H10P 72/7606: {characterised by edge clamping, e.g. clamping ring}
- H10P 72/7612: {characterised by lifting arrangements, e.g. lift pins}
- H10P 72/78: using vacuum or suction, e.g. Bernoulli chucks
- B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B08B: CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A substrate processing apparatus which can remove foreign matters attached to the entire upper surface of a substrate such as a wafer is disclosed. The substrate processing apparatus includes: a substrate holding apparatus; and a processing head configured to scrub an upper surface of a substrate. The substrate holding apparatus includes: a substrate holder configured to hold the substrate; and a substrate rotating mechanism configured to rotate the substrate held by the substrate holder. The substrate holder is disposed below the upper surface of the substrate so as not to project above the upper surface of the substrate in a state where the substrate is held by the substrate holder.

## Claims

### Claim 1

A substrate processing apparatus comprising:
a substrate holding apparatus; and
a processing head configured to scrub an upper surface of a substrate,
the substrate holding apparatus comprises:
a substrate holder configured to hold the substrate; and
a substrate rotating mechanism configured to rotate the substrate held by the substrate holder,
wherein the substrate holder is disposed below the upper surface of the substrate so as not to project above the upper surface of the substrate in a state where the substrate is held by the substrate holder.

### Claim 2 (depends on 1)

The substrate processing apparatus according to claim 1, wherein the substrate holder comprises a holding chuck configured to hold an outermost circumferential surface of the substrate, and
the holding chuck comprises a plurality of chuck members arranged at equal intervals around a rotation center of the substrate rotating mechanism.

### Claim 3 (depends on 2)

The substrate processing apparatus according to claim 2, wherein the substrate holding apparatus comprises a cleaning mechanism configured to clean a contact surface of the holding chuck which can make contact with the substrate.

### Claim 4 (depends on 2)

The substrate processing apparatus according to claim 2, wherein the substrate holder comprises:
a pusher configured to move the holding chuck in a direction toward the substrate; and
a releaser configured to move the holding chuck in a direction away from the substrate.

### Claim 5 (depends on 1)

The substrate processing apparatus according to claim 1, wherein the substrate holding apparatus comprises a substrate suction mechanism configured to suck and hold the substrate.

### Claim 6 (depends on 1)

The substrate processing apparatus according to claim 1, wherein the substrate holding apparatus comprises a substrate push-up mechanism configured to push up the substrate above the substrate holder.

### Claim 7 (depends on 1)

The substrate processing apparatus according to claim 1, wherein the substrate rotating mechanism comprises:
a holder support member configured to support the substrate holder; and
a rotating device coupled to the holder support member, the rotating device being configured to rotate the holder support member about a central axis of the substrate.

### Claim 8

A substrate holding apparatus comprising:
a substrate holder configured to hold a substrate; and
a substrate rotating mechanism configured to rotate the substrate held by the substrate holder,
wherein the substrate holder is disposed below an upper surface of the substrate so as not to project above the upper surface of the substrate in a state where the substrate is held by the substrate holder.

### Claim 9 (depends on 8)

The substrate holding apparatus according to claim 8, wherein the substrate holder comprises a holding chuck configured to hold an outermost circumferential surface of the substrate, and
the holding chuck comprises a plurality of chuck members arranged at equal intervals around a rotation center of the substrate rotating mechanism.

### Claim 10 (depends on 9)

The substrate holding apparatus according to claim 9, wherein the substrate holding apparatus comprises a cleaning mechanism configured to clean a contact surface of the holding chuck which can make contact with the substrate.

### Claim 11 (depends on 9)

The substrate holding apparatus according to claim 9, wherein the substrate holder comprises:
a pusher configured to move the holding chuck in a direction toward the substrate; and
a releaser configured to move the holding chuck in a direction away from the substrate.

### Claim 12 (depends on 8)

The substrate holding apparatus according to claim 8, wherein the substrate holding apparatus comprises a substrate suction mechanism configured to suck and hold the substrate.

### Claim 13 (depends on 8)

The substrate holding apparatus according to claim 8, wherein the substrate holding apparatus comprises a substrate push-up mechanism configured to push up the substrate above the substrate holder.

### Claim 14 (depends on 8)

The substrate holding apparatus according to claim 8, wherein the substrate rotating mechanism comprises:
a holder support member configured to support the substrate holder; and
a rotating device coupled to the holder support member, the rotating device being configured to rotate the holder support member about a central axis of the substrate.