# US 2019/0317567 A1 · Relative height adjustable connector system for motherboard to graphics board transition in information handling systems

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- Number: US 2019/0317567 A1
- Document ID: US20190317567A1
- Status: Published application
- Kind: A1
- Application number: 15/951,125
- Filed: 2018-04-11
- Published: 2019-10-17
- Earliest claimed: 2018-04-11
- Assignees: Dell Products L.P.
- Applicants: Dell Products, LP
- Inventors: Arnold Thomas Schnell; Ivan Guerra; Gurpreet Sahota
- Web page: https://patentgrep.com/patent/US20190317567A1

## CPC

- G06F 1/184: Mounting of motherboards
- G06F 1/185: Mounting of expansion boards
- G06F 1/203: {for portable computers, e.g. for laptops}
- G06T 1/20: Processor architectures; Processor configuration, e.g. pipelining
- H01R 12/59: for flexible printed circuits, flat or ribbon cables or like structures
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- G06T: IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

## Abstract

An information handling system comprising a chassis supporting a motherboard having a processor, a graphics board including a graphics processor, and an flexible compression jumper connector having a first compression jumper pad with a first array of compressible communication contacts operatively coupled to a first connector pad interface area with a plurality of electrical contacts on the motherboard and first clamping mechanism to compress the first array of compressible communication contacts to the plurality of electrical contacts on the motherboard. The flexible compression jumper connector having a second compression jumper pad with a second array of compressible communication contacts operatively coupled to a second connector pad interface area with a corresponding array of electrical contacts on the graphics board, and a second clamping mechanism to compress the second array of compressible communication contacts to the plurality of electrical contacts on the graphics board, where the flexible compression jumper connector has an adjustable jumper trace array cable between the first compression jumper pad and the second compression jumper pad such that the relative height of the graphics board adjacent to the motherboard may be modified.

## Claims

### Claim 1

An information handling system comprising:
a chassis supporting a motherboard having a processor;
a graphics board including a graphics processor;
a flexible compression jumper connector having a first compression jumper pad with a first array of compressible communication contacts operatively coupled to a first connector pad interface area with a plurality of electrical contacts on the motherboard;
a first clamping mechanism to compress the first array of compressible communication contacts to the plurality of electrical contacts on the motherboard;
the flexible compression jumper connector having a second compression jumper pad with a second array of compressible communication contacts operatively coupled to a second connector pad interface area with a corresponding array of electrical contacts on the graphics board;
a second clamping mechanism to compress the second array of compressible communication contacts to the plurality of electrical contacts on the graphics board; and
the flexible compression jumper connector having an adjustable jumper trace array cable between the first compression jumper pad and the second compression jumper pad such that the relative height of the graphics board adjacent to the motherboard may be modified.

### Claim 2 (depends on 1)

The system of claim 1, wherein the first array of compressible communication contacts is an array of electrical spring contacts making electrical contact when compressed to the first connector pad interface area.

### Claim 3 (depends on 1)

The system of claim 1, wherein the first connector pad interface area with a plurality of electrical contacts on the motherboard includes an array of electrical contacts on the motherboard corresponding to the first array of compressible communication contacts of the first compression jumper pad.

### Claim 4 (depends on 1)

The system of claim 1, wherein the second array of compressible communication contacts is an array of electrical spring contacts making electrical contact when compressed to the second connector pad interface area.

### Claim 5 (depends on 1)

The system of claim 1, wherein the first clamping mechanism and the second clamping mechanism are compression screws disposed through the first compression jumper pad and the second compression jumper pad respectively.

### Claim 6 (depends on 1)

The system of claim 1, further comprising:
a plurality of flexible compression jumper connectors operatively coupling the mother board and the graphics board.

### Claim 7 (depends on 1)

The system of claim 1, further comprising:
a plurality of PCIe lanes between the motherboard and the graphics board for communication via the flexible compression jumper connector.

### Claim 8 (depends on 1)

The system of claim 1, further comprising:
a plurality of display port channels between the motherboard and the graphics board for communication via the flexible compression jumper connector.

### Claim 9

An information handling system comprising:
a chassis supporting a motherboard having a central processor;
a graphics board including a graphics processor;
a flexible compression jumper connector having a first compression jumper pad with a first array of compressible electrical spring contacts operatively coupled to a first connector pad interface area with a plurality of electrical contacts on the motherboard;
the flexible compression jumper connector having a second compression jumper pad with a second array of compressible electrical spring contacts operatively coupled to a second connector pad interface area with a corresponding array of electrical contacts on the graphics board; and
the flexible compression jumper connector having an adjustable jumper trace array cable between the first compression jumper pad and the second compression jumper pad such that the relative height of the graphics board adjacent to the motherboard may be modified such that a top of central processor and a top of the graphics processor align in height relative to the bottom of the chassis.

### Claim 10 (depends on 9)

The system of claim 9, further comprising:
a planar heat pipe operatively coupled to the top of the central processor and the top of the graphics processor.

### Claim 11 (depends on 9)

The system of claim 9, wherein the first connector pad interface area with a plurality of electrical contacts on the motherboard is electrically coupled for communication of data with the first compression jumper pad when the first array of compressible electrical spring contacts are compressed to the first connector pad interface area on the motherboard.

### Claim 12 (depends on 9)

The system of claim 9, wherein the second connector pad interface area with a plurality of electrical contacts on the graphics board is electrically coupled for communication of data with the second compression jumper pad when the second array of compressible electrical spring contacts are compressed to the second connector pad interface area on the graphics board.

### Claim 13 (depends on 9)

The system of claim 9, further comprising:
a compression screw disposed through the first compression jumper pad of the flexible compression jumper connector and into a receiver disposed with the motherboard to compress the first array of compressible electrical spring contacts to the first connector pad interface area.

### Claim 14 (depends on 9)

The system of claim 9, further comprising:
a compression screw disposed through the second compression jumper pad of the flexible compression jumper connector and into a receiver disposed with the graphics board to compress the second array of compressible electrical spring contacts to the second connector pad interface area.

### Claim 15 (depends on 9)

The system of claim 9, further comprising:
a plurality of flexible compression jumper connectors operatively coupling the mother board and the graphics board.

### Claim 16

An information handling system comprising:
a chassis supporting a motherboard having a central processor;
a graphics board including a graphics processor;
a flexible compression jumper connector having a first compression jumper pad with a plurality of electrical contacts operatively coupled to a first connector pad interface area with a first array of compressible electrical spring contacts on the motherboard;
a first clamping mechanism to compress the first compression jumper pad to the first connector pad interface area on the motherboard;
the flexible compression jumper connector having a second compression jumper pad with a plurality of electrical contacts operatively coupled to a second connector pad interface area with a second array of compressible electrical spring contacts on the graphics board;
a second clamping mechanism to compress the second compression jumper pad to the second connector pad interface area on the graphics board; and
the flexible compression jumper connector having an adjustable jumper trace array cable between the first compression jumper pad and the second compression jumper pad such that the relative height of the graphics board adjacent to the motherboard may be modified. such that a top of central processor and a top of the graphics processor align in height relative to the bottom of the chassis.

### Claim 17 (depends on 16)

The system of claim 16, further comprising:
the relative height of the graphics board adjacent to the motherboard aligned such that a top of central processor and a top of the graphics processor align in height relative to the bottom of the chassis; and
a planar heat pipe operatively coupled to the top of the central processor and the top of the graphics processor.

### Claim 18 (depends on 16)

The system of claim 16, wherein the first clamping mechanism is a compression screw disposed through the first compression jumper pad of the flexible compression jumper connector and into a receiver disposed with the motherboard to compress the first array of compressible electrical spring contacts to the first connector pad interface area.

### Claim 19 (depends on 16)

The system of claim 16, the second clamping mechanism is a compression screw disposed through the second compression jumper pad of the flexible compression jumper connector and into a receiver disposed with the graphics board to compress the second array of compressible electrical spring contacts to the second connector pad interface area.

### Claim 20 (depends on 16)

The system of claim 16, further comprising:
a planar heat pipe operatively coupled to the top of the central processor and the top of the graphics processor.