# US 2019/0316009 A1 · Adhesive composition, cured product, and precision part

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- Number: US 2019/0316009 A1
- Document ID: US20190316009A1
- Status: Published application
- Kind: A1
- Application number: 16/309,534
- Filed: 2017-06-27
- Published: 2019-10-17
- Earliest claimed: 2016-07-04
- Assignees: Namics Corporation
- Applicants: Namics Corporation
- Inventors: Katsunori ARAI
- Web page: https://patentgrep.com/patent/US20190316009A1

## CPC

- C09J 11/06: organic
- C08F 20/18: with acrylic or methacrylic acids
- C08F 220/301: {and one oxygen in the alcohol moiety}
- C08F 222/40: Imides, e.g. cyclic imides
- C08G 73/0611: {with only one nitrogen atom in the ring, e.g. polypyrroles (polysuccinimides C08G73/1092)}
- C08K 3/08: Metals
- C08K 5/14: Peroxides
- C08K 5/32: Compounds containing nitrogen bound to oxygen
- C09J 4/00: Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16}
- C09J 11/04: inorganic
- C08K 2003/0806: {Silver}
- C08K 2003/0831: {Gold}
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)

## Abstract

To provide adhesive compositions that have a long pot life which, when used in a two-stage process involving partial curing and complete curing, can be cured completely at a temperature lower than that for partial curing. An adhesive composition including: a curable resin that is radically polymerizable; an organic peroxide having a one-minute half-life temperature of less than 100° C.; and a radical polymerization inhibitor, wherein a rate of viscosity increase of the adhesive composition at 25° C. and after 48 hours is 1.5 or less, partial curing of the adhesive composition is possible by heating at 100° C. to 180° C. for 1 to 5 second(s), and complete curing of the adhesive composition is possible by heating at 70° C. to 100° C. after the partial curing.

## Claims

### Claim 1

An adhesive composition comprising:
a curable resin that is radically polymerizable;
an organic peroxide having a one-minute half-life temperature of less than 100° C.; and
a radical polymerization inhibitor, wherein
a rate of viscosity increase of the adhesive composition at 25° C. and after 48 hours is 1.5 or less, a partial curing of the adhesive composition is possible by heating at 100° C. to 180° C. for 1 to 5 second(s), and a complete curing of the adhesive composition is possible by heating at 70° C. to 100° C. after the partial curing.

### Claim 2 (depends on 1)

The adhesive composition according to claim 1, wherein a heating condition for the partial curing is 120° C. and 3 seconds or less and a heating condition for the complete curing is 80° C.

### Claim 3 (depends on 1)

The adhesive composition according to claim 1, wherein the radical polymerization inhibitor is a nitrosamine compound.

### Claim 4 (depends on 1)

The adhesive composition according to claim 1, wherein the organic peroxide is any one of peroxybis(formic acid propyl) ester, peroxybis(formic acid isopropyl) ester, bis(4-tert-butylcyclohexyl) peroxydicarbonate, 1,1,3,3-tetramethylbutyl peroxyneodecanoate, peroxybis(formic acid sec-butyl) ester or a combination thereof.

### Claim 5 (depends on 1)

The adhesive composition according to claim 1, wherein the curable resin comprises 40% to 60% by weight of a curable resin contributing to radical polymerization and having a functional group equivalent weight of 600 to 900.

### Claim 6

An adhesive composition comprising:
a curable resin comprising 40% to 60% by weight of a curable resin contributing to radical polymerization and having a functional group equivalent weight of 600 to 900;
any one of peroxybis(formic acid propyl) ester, peroxybis(formic acid isopropyl) ester, bis(4-tert-butylcyclohexyl) peroxydicarbonate, 1,1,3,3-tetramethylbutyl peroxyneodecanoate, peroxybis(formic acid sec-butyl) ester; and
a nitrosamine compound.

### Claim 7 (depends on 1)

The adhesive composition according to claim 1, further comprising a precious metal filler.

### Claim 8 (depends on 1)

A cured product obtained by curing the adhesive composition according to claim 1.

### Claim 9 (depends on 8)

A precision part with the cured product according to claim 8.

### Claim 10 (depends on 6)

The adhesive composition according to claim 6, further comprising a precious metal filler.

### Claim 11 (depends on 6)

A cured product obtained by curing the adhesive composition according to claim 6.