# US 2019/0316005 A1 · Photo-curable adhesive composition, cured product and use thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0316005 A1 - Document ID: US20190316005A1 - Status: Published application - Kind: A1 - Application number: 16/452,808 - Filed: 2019-06-26 - Published: 2019-10-17 - Earliest claimed: 2016-12-29 - Assignees: Henkel AG & Co. KGaA - Applicants: Henkel AG & Co. KGaA - Inventors: Hongyu Wang; Minghui Liu - Web page: https://patentgrep.com/patent/US20190316005A1 ## CPC - C08G 18/6208: {Hydrogenated polymers of conjugated dienes} - C09J 4/06: {Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond} in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00 - B32B 7/12: using interposed adhesives or interposed materials with bonding properties - C08F 265/06: Polymerisation of acrylate or methacrylate esters on to polymers thereof - C08F 290/067: {Polyurethanes; Polyureas} - C09D 5/008: {Temporary coatings (C09D5/20 takes precedence)} - C09J 5/00: Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers - C09J 11/08: Macromolecular additives - C09J 133/10: Homopolymers or copolymers of methacrylic acid esters - C09J 133/14: of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen - C08L 2205/025: containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure - C09J 2301/416: use of irradiation - C09J 2433/00: Presence of (meth)acrylic polymer - C09J 2483/00: Presence of polysiloxane - H05K 5/03: Covers - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract The present disclosure relates to a photo-curable adhesive composition and the cured product thereof. The photo-curable adhesive composition according to the present disclosure comprises hydrophobic urethane (meth)acrylate polymers; a (meth)acrylate monomer or (meth)acrylamide monomer; a photoinitiator and a slip agent. The photo-curable adhesive composition according to the present disclosure exhibits good peelable property and optical property. ## Claims ### Claim 1 A photo-curable adhesive composition, comprising: a) a hydrophobic urethane (meth)acrylate polymer A having a weight average molecular weight of 35000 to 60000 g/mol; b) a hydrophobic urethane (meth)acrylate polymer B having a weight average molecular weight of 5000 to 25000 g/mol; c) at least one (meth)acrylate monomer or (meth)acrylamide monomer; d) at least one photoinitiator; and e) at least one slip agent. ### Claim 2 (depends on 1) The photo-curable adhesive composition according to claim 1, wherein hydrophobic urethane acrylate polymers A and B are independently selected from the group consisting of aliphatic urethane (meth)acrylates, aromatic urethane (meth)acrylates and mixtures thereof. ### Claim 3 (depends on 1) The photo-curable adhesive composition according to claim 1, comprising hydrophobic urethane (meth)acrylate polymer A in an amount from 5 to 40% by weight based on the total weight of the composition. ### Claim 4 (depends on 1) The photo-curable adhesive composition according to claim 1, comprising hydrophobic urethane (meth)acrylate polymer B in an amount from 10 to 40% by weight based on the total weight of the composition. ### Claim 5 (depends on 1) The photo-curable adhesive composition according to claim 1, wherein said (meth)acrylate monomer or (meth)acrylamide monomer is a mono-functional or di-functional (meth)acrylate monomer or (meth)acrylamide monomer having a glass transition temperature no less than 40° C. ### Claim 6 (depends on 1) The photo-curable adhesive composition according to claim 1, comprising the (meth)acrylate monomer or (meth)acrylamide monomer in an amount from 30 to 70% by weight based on the total weight of the composition. ### Claim 7 (depends on 1) The photo-curable adhesive composition according to claim 1, comprising the photoinitiator in an amount from 1 to 10% by weight based on the total weight of the composition. ### Claim 8 (depends on 1) The photo-curable adhesive composition according to claim 1, comprising at least two photoinitiators. ### Claim 9 (depends on 1) The photo-curable adhesive composition according to claim 1, wherein said slip agent is an acrylate functional polydimethylsiloxane. ### Claim 10 (depends on 1) The photo-curable adhesive composition according to claim 1, comprising the slip agent in an amount from 0.5 to 5% by weight based on the total weight of the composition. ### Claim 11 (depends on 1) The photo-curable adhesive composition according to claim 1, further comprising at least one defoamer. ### Claim 12 (depends on 1) The photo-curable adhesive composition according to claim 1, comprising: a) from 5 to 40% by weight, preferably from 8 to 15% by weight of a hydrophobic urethane (meth)acrylate polymer A, having a weight average molecular weight of 35000 to 60000 g/mol; b) from 10 to 40% by weight, preferably from 15 to 30% by weight of a hydrophobic urethane (meth)acrylate polymer B, having a weight average molecular weight of 5000 to 25000 g/mol; c) from 30 to 70% by weight, preferably from 50 to 60% by weight of a (meth)acrylate monomer or (meth)acrylamide monomer; d) from 1 to 10% by weight, preferably from 3 to 7% by weight of a photoinitiator; e) from 0.5 to 5% by weight, preferably from 1 to 2.5% by weight of a slip agent; and f) optionally from 0.5 to 1% by weight of a defoamer; based on the total weight of the composition. ### Claim 13 (depends on 1) Cured product of the photo-curable adhesive composition according to claim 1. ### Claim 14 (depends on 1) A process for forming a temporary protective film on a substrate, comprising steps of: a) applying the photo-curable adhesive composition according to claim 1 onto the substrate; and b) exposing the applied substrate to UV light to form a film.