# US 2019/0315098 A1 · Poly-supported copper foil > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0315098 A1 - Document ID: US20190315098A1 - Status: Published application - Kind: A1 - Application number: 16/451,806 - Filed: 2019-06-25 - Published: 2019-10-17 - Earliest claimed: 2016-04-27 - Assignees: Advanced Copper Foil Inc. - Applicants: Advanced Copper Foil Inc. - Inventors: Kieran HEALY - Web page: https://patentgrep.com/patent/US20190315098A1 ## CPC - B32B 15/09: comprising polyesters - B32B 7/06: permitting easy separation - B32B 7/12: using interposed adhesives or interposed materials with bonding properties - B32B 15/08: of synthetic resin - B32B 15/14: next to a fibrous or filamentary layer - B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} - B32B 27/322: {comprising halogenated polyolefins, e.g. PTFE} - B32B 27/36: comprising polyesters - B32B 27/38: comprising epoxy resins - H01B 1/02: mainly consisting of metals or alloys - H01B 3/42: polyesters; polyethers; polyacetals - B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer - B32B 2255/26: Polymeric coating - B32B 2262/101: Glass fibres - B32B 2307/306: Resistant to heat - B32B 2307/732: Dimensional properties - B32B 2307/748: Releasability - B32B 2457/00: Electrical equipment - B32B 2457/08: PCBs, i.e. printed circuit boards - B32B 2457/10: Batteries - B32B 2519/02: RFID tags - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) ## Abstract A method for manufacturing a printed circuit board (PCB) comprises firstly constructing a first book which includes first and second supported copper foils located at the bottom and top respectively. Each supported copper foil includes a respective poly-based film, a thin copper foil, and an adhesive provided between the film and the thin foil; the adhesive being permanently attached to the film and removably attached to the thin foil. The first book further comprises a first prepreg adjacent the thin foil of the first foil, copper clad laminates adjacent the first prepreg, and a second prepreg on a side of the copper clad laminates that opposes a side adjacent the first prepreg. Next, applying a lamination cycle to the first book using a laminating press to cure the first and second prepregs. Finally, removing the films from the thin foils associated with each of the first and second supported foil. ## Claims ### Claim 1 A method for manufacturing a printed circuit board (PCB), the method comprising: constructing a first book comprising: a first supported copper foil, the first supported copper foil comprising a poly-based film, a thin copper foil, and an adhesive provided between the poly-based film and the thin copper foil, the adhesive being permanently attached to the poly-based film and removably attached to the copper foil; a first prepreg adjacent the thin copper foil of the first supported copper foil; one or more copper clad laminates adjacent the first prepreg; a second prepreg on a side of the one or more copper clad laminates that opposes a side adjacent the first prepreg; and a second supported copper foil, the second supported copper foil comprising a poly-based film, thin foil copper and an adhesive provided between the poly-based film and the thin copper foil, the adhesive being permanently attached to the poly-based film and removably attached to the copper foil, wherein the second prepreg is adjacent the thin copper foil, applying a lamination cycle to the first book using a laminating press to cure the first prepreg and second prepreg; and after the lamination cycle, removing the poly-based film from the thin copper foil associated with the first supported copper foil and the poly-based film from the thin copper foil associated with the second supported copper foil. ### Claim 2 (depends on 1) The method of claim 1, further comprising: applying a separator plate on a first side of the first book; constructing, a second book adjacent the separator plate, the second book comprising: a first supported copper foil, the first supported copper foil comprising a poly-based film, a thin copper foil, and an adhesive provided between the poly-based film and the thin copper foil, the adhesive being permanently attached to the poly-based film and removably attached to the copper foil; a first prepreg adjacent the thin copper foil of the first supported copper foil; one or more copper clad laminates adjacent the first prepreg; a second prepreg on a side of the one or more copper clad laminates that opposes a side adjacent the first prepreg; and a second supported copper foil, the second supported copper foil comprising poly-based film, thin foil copper and an adhesive provided between the poly-based film and the thin copper foil, the adhesive being permanently attached to the poly-based film and removably attached to the copper foil, wherein the second prepreg is adjacent the thin copper foil. ### Claim 3 (depends on 2) The method of claim 2, wherein the separator plate is a stainless steel separator plate. ### Claim 4 (depends on 1) The method of claim 1, wherein the lamination cycle heats the first book to at least 180 degrees Celsius. ### Claim 5 (depends on 1) The method of claim 1, wherein the lamination cycle heats the first book to at least 200 degrees Celsius. ### Claim 6 (depends on 1) The method of claim 1, wherein the thin foil copper has a thickness of twelve microns or less. ### Claim 7 (depends on 1) The method of claim 1, wherein the thin foil copper is an ultrathin copper foil having a thickness of nine microns or less. ### Claim 8 (depends on 1) The method of claim 1, wherein the thin foil copper is an ultrathin copper foil having a thickness of seven microns or less. ### Claim 9 (depends on 1) The method of claim 1, wherein the thin foil copper is an ultrathin copper foil having a thickness of five microns or less. ### Claim 10 (depends on 1) The method of claim 1, wherein the adhesive is a low-tack adhesive that allows the thin copper foil to be easily removed from the poly-based film and the adhesive. ### Claim 11 (depends on 10) The method of claim 10, wherein the adhesive is uniform across a surface of the poly-based film and uniform across the surface of the thin copper foil. ### Claim 12 (depends on 11) The method of claim 11, wherein the adhesive is permanently applied to the poly-based film. ### Claim 13 (depends on 1) The method of claim 1, wherein the adhesive is non-silicone based. ### Claim 14 (depends on 1) The method of claim 1, wherein the adhesive is an acrylic adhesive. ### Claim 15 (depends on 1) The method of claim 1, wherein the poly-based film is one that does not deteriorate under heating at temperatures of one hundred and eighty degrees Celsius. ### Claim 16 (depends on 1) The method of claim 1, wherein the adhesive is applied uniformly across a surface of the poly-based film and uniformly across the surface of the thin copper foil. ### Claim 17 (depends on 1) The method of claim 1, wherein the poly-based film has a thickness of 45 microns or greater. ### Claim 18 (depends on 1) The method of claim 1, wherein the poly-based film has a thickness of between 45 and 100 microns.