A method of cooling an electronic device by using an apparatus for liquid immersion cooling including a casing configured to be partly filled with a first coolant and immerse, in the first coolant, a heat generating component other than a first heat generating component in a plurality of heat generating component, the method comprising:
- cooling the first heat generating component with a liquid cooling jacket which is included in the apparatus for liquid immersion cooling, and which is placed in contact with the first heat generating component placed inside the casing;
- cooling a second coolant with a cooling device included in the apparatus for liquid immersion cooling, by dissipating heat of the second coolant sent out from the liquid cooling jacket through a first pipe;
- and
- sending out the second coolant cooled by the cooling device to the liquid cooling jacket through a second pipe by a pump included in the apparatus for liquid immersion cooling.