Electronic component module, electric connection box, and wire harness
AssigneeYazaki Corporation
InventorYukihiro Kawamura
Life of this patent
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Abstract
An electronic component module includes a housing and a substrate which is configured to be housed in the housing. The substrate has a substrate side part which extends straight in a housing direction to the housing and which is configured to be guided to the housing when the substrate is housed. The housing has a substrate guide part which is configured to guide the substrate side part when the substrate is housed, a housing side wall on which the substrate guide part is formed, and a locked part which is formed to be continuous to an outer surface of the housing side wall and which is locked to an attachment destination.
Claims5
An electronic component module comprising:
- a housing;
- and
- a substrate which is configured to be housed in the housing,
- wherein the substrate has a substrate side part which extends straight in a housing direction to the housing and which is configured to be guided to the housing when the substrate is housed,
- wherein the housing has a substrate guide part which is configured to guide the substrate side part when the substrate is housed, a housing side wall on which the substrate guide part is formed, and a locked part which is formed to be continuous to an outer surface of the housing side wall and which is locked to an attachment destination,
- wherein the substrate guide part has a shape in which an end portion of the substrate side part is configured to be positioned outside the outer surface of the housing side wall when the substrate is housed, and
- wherein the locked part is positioned in a range from the outer surface of the housing side wall to an outer surface of the substrate guide part.
Dependencies are inferred from the claim text.