Loading patent…
AssigneeToppan Printing Co., Ltd.
InventorYasuyuki HITSUOKA
Estimating the term…
A wiring board, a multilayer wiring board, and a method of manufacturing a wiring board adapted to make the filling of through holes and the formation of fine wiring patterns. The wiring board comprises an insulator; a through hole between front and back surfaces of the insulator; a through hole conductor for electrically connecting front and back surface side openings; through hole lands around the front and the back surface side openings, and connected to the through hole conductor; lid plating conductors on the front and the back surface sides, and placed on the respective through hole lands; and wiring patterns formed on the front are compatible and the back surface of the insulator. The thickness of the through hole lands is 1.0 μm or more and 10.0 μm or less, and the area of each lid plating conductor is less than the area of each through hole land.
A wiring board comprising:
A method of manufacturing a wiring board, comprising the steps of:
Dependencies are inferred from the claim text.