Multilayer rigid flexible printed circuit board and method for manufacturing the same

A multilayer rigid flexible printed circuit board comprising:

• a flexible film comprising a first circuit pattern on one or both surfaces, and having an area corresponding to a rigid region and a flexible region of the multilayer rigid flexible printed circuit board, the first circuit pattern comprising a first portion in the flexible region and a second portion in the rigid region;
• a first insulating layer disposed on the flexible film in the flexible region to cover the first portion of the first circuit pattern and having an extension portion extending into the flexible film in the rigid region;
• a first adhesive disposed between the first circuit pattern and the first insulating layer;
• a copper pattern positioned at the rigid region of the flexible film and disposed on the extension portion of the first insulating layer;
• a second insulating layer disposed on the flexible film in the rigid region, covering the copper pattern, and comprising a second circuit pattern;
• and
• a plurality of conductive vias connecting to either one or both of the first circuit pattern and the second circuit pattern, wherein at least one of the plurality of conductive vias is not directly connected to the first circuit pattern.