Temperature sensor compression features for induction cooktop assembly
AssigneeWhirlpool Corporation
InventorsDavide Parachini, Cristiano Vito Pastore
Life of this patent
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Abstract
An induction cooking apparatus comprises an induction coil forming a top surface and a bottom surface. The induction coil comprises a plurality of conductive windings. A temperature sensor protrudes through the top surface of the induction coil. An electrical circuit is in communication with the temperature sensor. The electrical circuit is disposed on a substrate, which may form a chassis configured to support a plurality of conductive connections. The substrate forms a spring mechanism in connection with the temperature sensor.
Claims20
An induction cooking apparatus comprising:
- an induction coil forming a top surface and a bottom surface and comprising a plurality of conductive windings;
- a temperature sensor protruding through the top surface;
- and
- an electrical circuit in communication with the temperature sensor, wherein the electrical circuit is disposed on a substrate, wherein the substrate forms a spring mechanism in connection with the temperature sensor.
An induction coil assembly for a cooking apparatus comprising:
- an induction coil comprising a plurality of conductive windings disposed around a coil former, the coil former comprising a top surface and a bottom surface;
- a temperature sensor exposed above the top surface of the coil former;
- a support beam configured to support the induction coil;
- and
- a control circuit in connection with the support beam and in communication with the induction coil and the temperature sensor, wherein the control circuit comprises a spring mechanism formed from a portion of a substrate of the control circuit.
An induction cooking apparatus comprising:
- an induction coil forming a top surface and a bottom surface and comprising a plurality of conductive windings;
- a temperature sensor protruding through the top surface;
- and
- an electrical circuit in communication with the temperature sensor, wherein the electrical circuit is disposed on a substrate, wherein the substrate forms a spring mechanism in connection with the temperature sensor, wherein the spring mechanism forms a cantilevered structure from the substrate with portions of the substrate forming openings.
Dependencies are inferred from the claim text.