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US 2019/0297428 A1Published application
Method and wafer for fabricating transducer devices
AssigneeCirrus Logic International Semiconductor Ltd.
InventorsMarek Sebastian PIECHOCINSKI, Tsjerk Hans HOEKSTRA
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Abstract
A wafer for use in fabricating a plurality of individual transducer devices comprises a bracing structure for partitioning the wafer into a plurality of regions, and a plurality of transducer devices fabricated in one or more of the plurality of regions.
Claims19
A wafer for use in fabricating a plurality of individual transducer devices, the wafer comprising:
- a bracing structure for partitioning the wafer into a plurality of regions;
- and
- a plurality of transducer devices fabricated in each of at least one or more of the plurality of regions, wherein a transducer device fabricated in the water comprises a micro-electrical-mechanical system (MEMS) transducer, comprising:
- a substrate;
- a back-volume formed in the substrate;
- and
- a membrane formed over the back-volume and on the substrate;
- wherein the back-volume comprises a first back-volume portion and a second back-volume portion, the first back-volume portion being separated from the second back-volume portion by a step in a sidewall of the back-volume;
- wherein the bracing structure is formed from areas of the wafer where no transducer devices are fabricated within the wafer.
6 more elements
-19. (canceled)
A method of fabricating a plurality of transducer devices on a semiconductor wafer, the method comprising:
- forming a bracing structure in the semiconductor wafer;
- wherein the bracing structure partitions the semiconductor wafer into a plurality of processing regions where transducer devices are fabricated in each of the plurality of regions;
- forming the plurality of transducer devices in the form of micro-electrical-mechanical system (MEMS) transducers comprising:
- a substrate;
- a back-volume formed in the substrate;
- and
- a membrane formed over the back-volume and on the substrate;
- wherein the back-volume comprises a first back-volume portion and a second back-volume portion, the first back-volume portion being separated from the second back-volume portion by a step in a sidewall of the back-volume;
- and
- wherein the bracing structure is formed from areas of the wafer where no transducer devices are fabricated within the wafer.
7 more elements
-56. (canceled)
Dependencies are inferred from the claim text.