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US 2019/0296754 A1Published application
Apparatus and method for a vapor cell atomic frequency reference having improved frequency stability
AssigneeHoneywell International Inc.
InventorsJeffrey James Kriz, Robert Compton
Life of this patent
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Abstract
A chip scale atomic clock (CSAC) is provided. The CSAC comprises: a temperature stabilized physics system, comprising a vapor cell and a magnetic field coil, and which is enclosed in a magnetic shield; and a temperature stabilized electronics circuitry electrically coupled to the temperature stabilized physics system.
Claims20
A chip scale atomic clock (CSAC), comprising:
- a temperature stabilized physics system, comprising a vapor cell and a magnetic field coil, and which is enclosed in a magnetic shield;
- and
- a temperature stabilized electronics circuitry electrically coupled to the temperature stabilized physics system.
A method, comprising:
- when the ambient temperature of a chip scale atomic clock (CSAC) increases, extending fluid away, due to thermal expansion, from at least one reservoir towards or away from a thermally isolated subsystem in at least one of the temperature stabilized electronics circuitry and the temperature stabilized physics system, where the CSAC comprises a temperature stabilized electronics circuitry and a temperature stabilized physics system, each of which comprises a non-thermally isolated subsystem and a thermally isolated subsystem that are thermally isolated from one another;
- and
- maintaining a substantially constant set point temperature of the thermally isolated subsystem, in the at least one of the temperature stabilized electronics circuitry and the temperature stabilized physics system, by increasing thermal energy dissipated from the thermally isolated subsystem to the non-thermally isolated subsystem through the fluid, where the substantially constant set point temperature means a temperature with in a range of temperatures that does not decrease the stability of the CSAC.
A method of forming a passive heat sink in a temperature stabilized electronics circuitry or a temperature stabilized physics system of a chip scale atomic clock (C SAC), comprising:
- forming a first substrate with a first layer on the first substrate and second substrate with the first layer on the second substrate from a single substrate with the first layer on the single substrate;
- forming at least one opening in the first layer over at least one of the first substrate and the second substrate;
- forming a reservoir under each opening;
- filling each reservoir with a fluid;
- forming at least one recess in a second layer on a handle wafer;
- attaching the second layer to the first layer;
- and
- removing the handle wafer.
5 more elements
Dependencies are inferred from the claim text.