Symmetrical power stages for high power integrated circuits
AssigneeMonolithic Power Systems, Inc.
InventorsJinghai ZHOU, Chia-Hsin CHANG
Life of this patent
Estimating the term…
Abstract
A circuit assembly for a power converter includes power stage blocks and heat-dissipating substrate. A power stage block includes a power stage IC die, an output inductor that is connected to a switch node of the power stage IC die, and capacitors that form an output capacitor of the power stage block. The output capacitors of the power stage blocks are symmetrically arranged. The output inductors can be placed on the same side of the substrate as the power stage IC dies, or on a side of the substrate that is opposite to the side where the power stage IC dies are disposed. A power stage block may generate two output phases of the power converter.
Claims20
A circuit assembly comprising:
- a heat-dissipating substrate, the substrate having a first side and a second side that is opposite the first side;
- a first power stage integrated circuit (IC) die disposed on the first side of the substrate;
- a second power stage IC die disposed on the first side of the substrate;
- a first output inductor disposed over the first power stage IC die and the second power stage IC die on the first side of the substrate, the first output inductor having a first end that is coupled to a switch node of the first power stage IC die and a second end that is coupled to an output node;
- a second output inductor disposed over the first power stage IC die and the second power stage IC die on the first side of the substrate, the second output inductor having a first end that is coupled to a switch node of the second power stage IC die and a second end that is coupled to the output node;
- and
- an integrated circuit that is disposed on the second side of the substrate, the integrated circuit being powered by a voltage at the output node.
A circuit assembly comprising:
- a heat-dissipating substrate having a first side and a second side, the first side being opposite the second side;
- a first power stage integrated circuit (IC) die and a second power stage IC die that are embedded within the substrate;
- a first output inductor disposed on the first side of the substrate, the first output inductor having a first end that is coupled to a switch node of the first power stage IC die and a second end that is coupled to an output node;
- a second output inductor disposed on the first side of the substrate, the second output inductor having a first end that is coupled to a switch node of the second power stage IC die and a second end that is coupled to the output node of the power converter;
- and
- a system on chip (SOC) die disposed on the second side of the substrate, the SOC die being powered by a voltage at the output node.
A circuit assembly comprising:
- a heat-dissipating substrate having a first side and a second side, the first side being opposite the second side;
- a first power stage block disposed on the first side of the substrate, the first power stage block comprising a first power stage integrated circuit (IC) die, a second power stage IC die, a first output inductor having a first end that is coupled to a switch node of the first power stage IC die and a second end that is coupled to an output node, a second output inductor having a first end that is coupled to a switch node of the second power stage IC die and a second end that is coupled to the output node, wherein the first and second output inductors are disposed over the first and second power stage IC dies on the first side of the substrate;
- and
- a system on a chip (SOC) die that is disposed on the second side of the substrate, the SOC die being powered by a voltage at the output node.
Dependencies are inferred from the claim text.