Tft substrate, scanning antenna provided with tft substrate, and method for producing tft substrate

A TFT substrate including a transmission and/or reception region including a plurality of antenna unit regions and a non-transmission and/or reception region located in a region other than the transmission and/or reception region, each of the antenna unit regions including a TFT and a patch electrode electrically connected to a drain electrode of the TFT, the TFT substrate comprising:

• a dielectric substrate;
• a gate metal layer supported by the dielectric substrate, the gate metal layer including a plurality of gate bus lines;
• a gate insulating layer disposed on the gate metal layer;
• a source metal layer disposed on the gate insulating layer, the source metal layer including a plurality of source bus lines;
• a first insulating layer disposed on the source metal layer;
• a patch metal layer disposed on the first insulating layer, the patch metal layer including the patch electrode;
• a second insulating layer disposed on the patch metal layer;
• and
• an upper transparent conductive layer disposed on the second insulating layer,
• wherein the TFT includes a source electrode electrically connected to one of the source bus lines, and the TFT includes a gate electrode electrically connected to one of the gate bus lines,
• the gate metal layer further includes a plurality of gate connection wiring lines disposed in the non-transmission and/or reception region, the gate connection wiring lines being electrically separated from the gate bus lines,
• each of the source bus lines is electrically connected to one of the gate connection wiring lines via a conductor section,
• the TFT substrate further includes a lower transparent conductive layer disposed between the first insulating layer and the patch metal layer, and
• the lower transparent conductive layer is in contact with the gate connection wiring line in a second opening provided in the gate insulating layer and the first insulating layer, and includes the conductor section coming into contact with the source bus line in a first opening provided in the first insulating layer.