Integrated spring mounted chip termination
AssigneeSmiths Interconnect Americas, Inc.
InventorsChristopher Raymond Hawn, Michael Joseph Kettner
Life of this patent
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AssigneeSmiths Interconnect Americas, Inc.
InventorsChristopher Raymond Hawn, Michael Joseph Kettner
Estimating the term…
An integrated spring mounted chip termination for converting energy of a circuit into heat to be absorbed by a heatsink. The integrated spring mounted chip termination includes an input tab configured to connect to the circuit. The integrated spring mounted chip termination also includes a chip termination having a top surface. The chip termination includes an input contact located on the top surface and configured to connect to the input tab, a resistor element located on the top surface and connected to the input contact, and a ground contact located on the top surface and connected to the resistor element. The integrated spring mounted chip termination also includes a formed ground spring connected to the ground contact of the chip termination, the formed ground spring configured to attach the chip termination to the heatsink, such that the chip termination and the heatsink are in contact.
An integrated spring mounted chip termination for converting energy of a circuit into heat to be absorbed by a heatsink, the integrated spring mounted chip termination comprising:
A system for converting energy of a circuit into heat to be absorbed by a heatsink, the system comprising:
A method for manufacturing an integrated spring mounted chip termination comprising:
Dependencies are inferred from the claim text.