Method for Manufacturing an Optoelectronic Component and Optoelectronic Component

A method for manufacturing an optoelectronic component, the method comprising:

• applying a conversion layer including a luminescence conversion material to a support plate including a glass;
• arranging at least two optoelectronic semiconductor chips over the conversion layer on a side remote from the support plate;
• and
• forming an envelope material free from a luminescence conversion material between the optoelectronic semiconductor chips, thereby forming a workpiece.

An optoelectronic component comprising

• an optoelectronic semiconductor chip;
• a conversion layer arranged at an upper surface of the semiconductor chip;
• and
• a cover plate including a glass,
• wherein the conversion layer includes a luminescence conversion material,
• wherein the conversion layer is arranged between the optoelectronic semiconductor chip and the cover plate, and
• wherein lateral surfaces of the optoelectronic semiconductor chip are substantially free from the conversion layer.

An optoelectronic component comprising:

• an optoelectronic semiconductor chip;
• a conversion layer arranged at an upper surface of the semiconductor chip;
• and
• a cover plate including a glass,
• wherein the conversion layer is arranged between the optoelectronic semiconductor chip and the cover plate, and
• wherein a sidewall of the cover plate defines a sidewall of the optoelectronic component.