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US 2019/0296198 A1Published application
Led assembly
AssigneesEpistar Corporation, Kaistar Lighting (Xiamen) Co., Ltd.
InventorsTZER-PERNG CHEN, TZU-CHI CHENG
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Abstract
This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.
Claims20
An LED assembly, comprising:
- a substrate comprising a first top surface;
- a mount disposed on the first top surface and having a first inner side surface and a second inner side surface facing the first inner side surface;
- a plurality of LED chips disposed on the first top surface in an arrangement between the first inner side surface and the second inner side surface, and comprising a second top surface;
- an electrode plate formed on the mount, electrically connected to the plurality of LED chips, and comprising a third top surface;
- a phosphor layer covering the plurality of LED chips, the mount, and the electrode plate, wherein the third top surface is higher than the second top surface in an elevation based on the first top surface.
2 more elements
An LED assembly, comprising:
- a substrate comprising a first top surface;
- a first mount disposed on the first top surface and having a first side surface;
- a second mount disposed on the first top surface, physically separated from the first mount, and having a second side surface facing the first side surface;
- a plurality of LED chips disposed on the first top surface, and arranged between the first side surface and the second side surface;
- a first electrode plate formed on the first mount;
- a second electrode plate formed on the second mount;
- and
- a phosphor layer covering the plurality of LED chips, the first mount, and the second mount,
- wherein the plurality of LED chips is electrically connected to the first electrode plate and the second electrode plate by bonding wires.
6 more elements
Dependencies are inferred from the claim text.