Substrate for optical device, optical device package, manufacturing method of substrate for optical device, and manufacturing method of optical device package

A substrate for an optical device, the substrate comprising:

• first and second metal members bonded together with a vertical insulating part interposed therebetween;
• a first island plating layer formed on a top surface of the first metal member;
• a first space region formed outside of the first island plating layer to expose the top surface of the first metal member;
• a first peripheral plating layer formed on the top surface of the first metal member except for the first island plating layer and the first space region;
• a second island plating layer formed on a top surface of the second metal member;
• a second space region formed outside of the second island plating layer to expose the top surface of the second metal member;
• and
• a second peripheral plating layer formed on the top surface of the second metal member except for the second island plating layer and the second space region.

An optical device package, comprising:

• first and second metal members bonded together with a vertical insulating part interposed therebetween;
• a first island plating layer formed on a top surface of the first metal member;
• a space region formed outside of the first island plating layer to expose the top surface of the first metal member;
• a first peripheral plating layer formed on the top surface of the first metal member except for the first island plating layer and the space region;
• a second plating layer formed on a top surface of the second metal member;
• a solder provided on the first island plating layer;
• an optical device provided on the solder and having a first terminal electrically connected to the first metal member;
• and
• a wire electrically connecting a second terminal of the optical device to the second metal member.