Transfer apparatus and transfer method for transferring light emitting diode chip

A method for transferring a plurality of light emitting diode chips, comprising:

• preparing a first substrate having the plurality of light emitting diode chips mounted on one surface;
• preparing a second substrate to which the plurality of light emitting diode chips are to be transferred;
• and
• transferring the plurality of light emitting diode chips to the second substrate by pushing the other surface of the first substrate in a state that one surface of the first substrate and the second substrate are disposed to face each other,
• wherein the transferring of the plurality of light emitting diode chips to the second substrate includes transferring a plurality of light emitting diode chips corresponding to each of the plurality of push pins to the second substrate at a time.

A transfer apparatus for transferring a light emitting diode chip, comprising:

• a stage on which a first substrate having the light emitting diode chip mounted on one surface is placed;
• a work table on which a second substrate to which the light emitting diode chip is to be transferred is placed;
• and
• a push pin module for transferring the light emitting diode chip to the second substrate by pushing a portion corresponding to the light emitting diode chip from the other surface of the first substrate in a state that one surface of the first substrate and the second substrate are disposed to face each other,
• wherein the push pin module includes a pressure control unit for maintaining a pressure between the light emitting diode chip and the second substrate to be a predetermined pressure.

A method for transferring a light emitting diode chip, comprising:

• preparing a first substrate having the light emitting diode chip mounted on one surface;
• preparing a second substrate to which the light emitting diode chip is to be transferred;
• and
• transferring the light emitting diode chip to the second substrate by pushing a portion corresponding to the light emitting diode chip from the other surface of the first substrate in a state that one surface of the first substrate and the second substrate are disposed to face each other,
• wherein the transferring of the light emitting diode chip to the second substrate includes maintaining a pressure between the light emitting diode chip and the second substrate to be a predetermined pressure.

A transfer apparatus for transferring a plurality of light emitting diode chips, comprising:

• a stage on which a first substrate having the light emitting diode chip mounted on one surface is placed;
• a work table on which a second substrate to which the light emitting diode chip is to be transferred is placed;
• and
• a push pin module for transferring the light emitting diode chip to the second substrate by pushing the other surface of the first substrate in a state that one surface of the first substrate and the second substrate are disposed to face each other,
• wherein the stage includes a main actuator for controlling movement of the stage to a standby position and a sub-actuator for controlling movement of the stage between pitches of light emitting diode chip.

A micro-LED produced by a method for transferring a light emitting diode chip, comprising:

• preparing a first substrate having the light emitting diode chip mounted on one surface;
• preparing a second substrate to which the light emitting diode chip is to be transferred;
• and
• transferring the light emitting diode chip to the second substrate by pushing a portion corresponding to the light emitting diode chip from the other surface of the first substrate in a state that one surface of the first substrate and the second substrate are disposed to face each other,
• wherein the transferring of the light emitting diode chip to the second substrate includes maintaining a pressure between the light emitting diode chip and the second substrate to be a predetermined pressure.