Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsYoko Iwakaji, Tomoko Matsudai
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsYoko Iwakaji, Tomoko Matsudai
Estimating the term…
A semiconductor device according to as embodiment includes a semiconductor layer having a first plane and a second plane; a first trench provided in the semiconductor layer; a first gate electrode provided in the first trench; a second trench provided in the semiconductor layer; a second gate electrode provided in the second trench; a third trench provided in the semiconductor layer; a first resistive layer provided in the third trench; a first electrode provided on a side of the first plane of the semiconductor layer; a second electrode provided on a side of the second plane of the semi conductor layer; and a gate electrode pad provided on the side of the first plane of the semiconductor layer, is electrically connected to the first gate electrode through the first resistive layer, and is electrically connected to the second gate electrode.
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.