Semiconductor memory device
AssigneeToshiba Memory Corporation
InventorsTakeshi MURATA, Yoshinori NAKAKUBO, Hiroaki HAYASAKA, Naoki YAMAMOTO
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AssigneeToshiba Memory Corporation
InventorsTakeshi MURATA, Yoshinori NAKAKUBO, Hiroaki HAYASAKA, Naoki YAMAMOTO
Estimating the term…
A semiconductor memory device includes a first insulating layer over a semiconductor substrate, a metal layer, an adhesive layer on a first region of the metal layer, a conductive layer on a second region of the metal layer and on the adhesive layer, a second insulating layer on the conductive layer, a plurality of wiring layers that are separated from each other and are stacked above the second insulating layer, a semiconductor layer that extends in a first direction perpendicular to the semiconductor substrate and includes a bottom surface connected to the conductive layer, a storage portion disposed between at least one of the plurality of wiring layers and the semiconductor layer, and a slit that extends in the first direction, includes aside surface in contact with the plurality of wiring layers and a bottom surface reaching the conductive layer, and is filled with an insulating material.
A semiconductor memory device comprising:
A semiconductor memory device comprising:
A semiconductor memory device comprising:
Dependencies are inferred from the claim text.