US 2019/0296014 A1 · Circuit Arrangement, Redistribution Board, Module and Method of Fabricating a Half-Bridge Circuit

Abstract

In an embodiment, a circuit arrangement is provided that includes a half-bridge circuit and a substrate having a major surface. The half-bridge circuit includes a high voltage node, a low voltage node and an output node. A high side switch and a low side switch are coupled in series and provide a pair and n pairs are coupled in parallel between the high voltage node and the low voltage node, n being an integer greater than or equal to 2. The output node is provided by an output connector on the major surface of the substrate. The output connector has an axis perpendicular to the major surface of the substrate and the n pairs are arranged on the major surface of the substrate and are uniformly distributed around the axis of the output connector.

Claims15

Dependent claims

A circuit arrangement, comprising:

a half-bridge circuit comprising:
a high voltage node;
a low voltage node;
an output node;
wherein a high side switch and a low side switch are coupled in series and provide a pair and n pairs are coupled in parallel between the high voltage node and the low voltage node, n being an integer greater than or equal to 2,
a substrate having a major surface;
wherein the output node is provided by an output connector on the major surface of the substrate, the output connector having an axis perpendicular to the major surface of the substrate, and the n pairs are arranged on the major surface of the substrate and are uniformly distributed around the axis of the output connector.

4 more elements

A method of fabricating a circuit arrangement for a half-bridge circuit, the method comprising:

providing an output connector on a substrate, the output connector providing an output node of the half-bridge circuit and having an axis that is perpendicular to a major surface of the substrate;
arranging n high side switches on the major surface of the substrate such that an angle α formed between adjacent ones of the high side switches with respect to the axis is 360°/n, n being an integer greater than or equal to 2;
and
arranging n low side switches on the major surface of the substrate such that an angle α formed between adjacent ones of the low side switches with respect to the axis is 360°/n, the low side switches and the high side switches being arranged alternately around the axis of the output connector.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

16/358,309Filed 19 Mar 2019

Priority

EP 18163094.821 Mar 2018

Published

26 Sep 2019

Term ends

Not estimatedThe source records don’t support an estimate.

Classification20 codes

H02M 7/003
Conversion of AC power input into DC power output; Conversion of DC power input into AC power output: constructional details, e.g. physical…
H02M 7/493
Using discharge tubes with control electrode or semiconductor devices with control electrode: the static converters being arranged for operation…
H03K 17/6871
The devices being field-effect transistors: the output circuit comprising more than one controlled field-effect transistor
H10D 84/856
Complementary IGFETs, e.g. CMOS: the complementary IGFETs having different architectures than each other, e.g. high-voltage and low-voltage CMOS

Circuit Arrangement, Redistribution Board, Module and Method of Fabricating a Half-Bridge Circuit

Life of this patent

Circuit Arrangement, Redistribution Board, Module and Method of Fabricating a Half-Bridge Circuit

Life of this patent

Abstract

Claims15