Semiconductor device and semiconductor package
AssigneeKabushiki Kaisha Toshiba
InventorKentaro Ikeda
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AssigneeKabushiki Kaisha Toshiba
InventorKentaro Ikeda
Estimating the term…
A semiconductor device according to an embodiment is a semiconductor device including: a normally-off transistor having a first source, a first drain, and a first gate; a normally-on transistor having a second source electrically connected to the first drain, a second drain, and a second gate; a first capacitor having a first end and a second end, the second end electrically connected to the second gate; a first diode having a first anode electrically connected between the second end and the second gate, and a first cathode; a first resistor electrically connected between the first end and the first gate; a second diode having a second anode electrically connected to the first end, and a second cathode electrically connected to the first gate, the second diode provided in parallel to the first resistor; a gate drive circuit electrically connected to the first resistor and the second anode, a reference potential wiring being connected to the gate drive circuit and the first source; and a second capacitor having a third end and a fourth end, the third end electrically connected to the reference potential wiring and the fourth end electrically connected to the second source.
A semiconductor device comprising:
A semiconductor package comprising:
Dependencies are inferred from the claim text.