Semiconductor Package and Method

A method comprising:

• providing a first package component and a second package component, the first package component comprising first regions, the second package component comprising second regions;
• aligning the first regions of the first package component with the second regions of the second package component;
• performing laser shots on a top surface of the first package component, each of the laser shots being performed sequentially, each respective laser shot of the laser shots overlapping a respective first region of the first regions and a respective second region of the second regions, a conductive material between the respective first region and the respective second region being reflowed by the respective laser shot;
• and
• after performing the laser shots, singulating the first regions of the first package component and the second regions of the second package component.

A package comprising:

• a first package comprising a first conductive feature and a second conductive feature;
• a second package comprising a third conductive feature and a fourth conductive feature;
• a first conductive connector joining the third conductive feature to the first conductive feature;
• a first inter-metallic compound (IMC) between the first conductive connector and the first conductive feature, the first IMC having a first thickness;
• a second conductive connector joining the fourth conductive feature to the second conductive feature;
• and
• a second IMC between the second conductive connector and the second conductive feature, the second IMC having a second thickness less than the first thickness.