Semiconductor manufacturing method, semiconductor manufacturing apparatus and semiconductor device

A semiconductor manufacturing apparatus that sequentially stacks a plurality of semiconductor chips while aligning the plurality of semiconductor chips on a stage, the apparatus comprising:

• a condition determinator that determines whether a predetermined condition is satisfied during a mounting processing of the plurality of semiconductor chips;
• an evacuation controller that, when it is determined that the predetermined condition is satisfied, evacuates a group of semiconductor chips which has been stacked before the determination;
• a resuming determinator that determines whether to resume the mounting processing after it is determined that the predetermined condition is satisfied;
• and
• a return controller that returns the evacuated group of semiconductor chips to a position before the evacuation and continues the mounting processing when it is determined that the mounting processing is resumed.

A semiconductor device comprising:

• n (n is an integer of 2 or more) steps of semiconductor chips,
• wherein each of the semiconductor chips on a second and subsequent steps among the n steps of semiconductor chips includes
• a pad for connection with a lower semiconductor chip by one step, and
• a first alignment mark that aligns with the lower semiconductor chip by one step, and
• wherein the lowermost semiconductor chip among the n steps of semiconductor chips comprises a second alignment mark arranged so as not to vertically overlap with a stacked body of the n steps of semiconductor chips.