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US 2019/0295997 A1Published application
Semiconductor devices and methods of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorYun-Rae CHO
Life of this patent
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Abstract
A semiconductor device includes a package substrate, a semiconductor chip on a first region of the package substrate, and a solder bump on a second region of the package substrate. The solder bump includes a core portion and a peripheral portion encapsulating the core portion. The peripheral portion includes a first segment with a first melting point and a second segment with a second melting point that is less than the first melting point.
Claims20
A semiconductor device comprising:
- a first package substrate;
- a second package substrate;
- and
- a solder joint between the first package substrate and the second package substrate,
- wherein the solder joint comprises:
- a core portion;
- a lower solder portion comprises an Sn—Ag based alloy or an Sn—Cu based alloy, the lower solder portion disposed on and contacting a first contact pad of the first package substrate;
- and
- an upper solder portion comprises an Sn—Pb based alloy or an Sn—Bi based alloy, the upper solder portion disposed on and contacting a second contact pad of the second package substrate and an uppermost surface of the lower solder portion, and
- wherein the lower solder portion at least partially envelope the core portion.
7 more elements
A semiconductor device comprising:
- a first package substrate;
- a second package substrate;
- and
- a solder joint disposed between the first package substrate and the second package substrate, and connect the first package substrate to the second package substrate,
- wherein the solder joint comprises a core portion provided in a lower part of the solder joint, and
- the core portion has a first melting point greater than a second melting point of the solder joint.
3 more elements
A semiconductor device comprising:
- a bottom package, the bottom package comprise a first package substrate, and a first semiconductor chip mounted on the first package substrate;
- a top package mounted on the bottom package, the top package comprise a second package substrate, a second semiconductor chip mounted on the second package substrate, and a first mold layer cover the second semiconductor chip;
- and
- a solder joint disposed between the first package substrate and the second package substrate, and connect the bottom package to the top package,
- wherein the solder joint comprises a core portion provided in a lower part of the solder joint.
2 more elements
Dependencies are inferred from the claim text.