Micro light-emitting diode display fabrication and assembly
AssigneeIntel Corporation
InventorsKhaled AHMED, Anup PANCHOLI
Life of this patent
Estimating the term…
Abstract
Micro light-emitting diode (LED) display fabrication and assembly are described. In an example, a micro-light emitting diode (LED) display panel includes a display backplane substrate having a plurality of metal bumps thereon. A plurality of LED pixel elements includes ones of LED pixel elements bonded to corresponding ones of the plurality of metal bumps of display backplane substrate. One or more of the plurality of LED pixel elements has a graphene layer thereon. The graphene layer is on a side of the one or more of the plurality of LED pixel elements opposite the side of the metal bumps.
Claims24
A micro-light emitting diode (LED) display panel, comprising:
- a display backplane substrate having a plurality of metal bumps thereon;
- a plurality of LED pixel elements comprising ones of LED pixel elements bonded to corresponding ones of the plurality of metal bumps of display backplane substrate, one or more of the plurality of LED pixel elements having a graphene layer thereon, the graphene layer on a side of the one or more of the plurality of LED pixel elements opposite the side of the metal bumps.
A method of manufacturing a micro-light emitting diode (LED) display panel, the method comprising:
- positioning a silicon substrate above a display backplane substrate, the silicon substrate having a plurality of light-emitting diode (LED) pixel elements coupled to a patterned conductive region and dielectric region nucleation layer thereon, and the display backplane substrate having a plurality of metal bumps thereon;
- aligning the silicon substrate with the display backplane substrate;
- moving the display backplane substrate and the silicon substrate together to couple at least a portion of the plurality of LED pixel elements to corresponding ones of the plurality of metal bumps;
- irradiating the patterned conductive region and dielectric region nucleation layer with an IR laser to transfer and bond the portion of the plurality of LED pixel elements to the corresponding ones of the plurality of metal bumps;
- and, subsequently,
- separating the silicon substrate from the display backplane substrate.
A method of manufacturing a micro-light emitting diode (LED) display panel, the method comprising:
- positioning a silicon substrate above a display backplane substrate, the silicon substrate having a plurality of light-emitting diode (LED) pixel elements coupled to a graphene nucleation layer thereon, and the display backplane substrate having a plurality of metal bumps thereon;
- aligning the silicon substrate with the display backplane substrate;
- moving the display backplane substrate and the silicon substrate together to couple at least a portion of the plurality of LED pixel elements to corresponding ones of the plurality of metal bumps;
- irradiating the graphene nucleation layer with an IR laser to transfer and bond the portion of the plurality of LED pixel elements to the corresponding ones of the plurality of metal bumps;
- and, subsequently,
- separating the silicon substrate from the display backplane substrate.
A method of manufacturing a micro-light emitting diode (LED) display panel, the method comprising:
- positioning a silicon substrate above a display backplane substrate, the silicon substrate having a plurality of light-emitting diode (LED) pixel elements coupled to an AlN nucleation layer thereon, the AlN nucleation layer formed using hydrazine, and the display backplane substrate having a plurality of metal bumps thereon;
- aligning the silicon substrate with the display backplane substrate;
- moving the display backplane substrate and the silicon substrate together to couple at least a portion of the plurality of LED pixel elements to corresponding ones of the plurality of metal bumps;
- irradiating the AlN nucleation layer with an IR laser to transfer and bond the portion of the plurality of LED pixel elements to the corresponding ones of the plurality of metal bumps;
- and, subsequently,
- separating the silicon substrate from the display backplane substrate.
Dependencies are inferred from the claim text.