Semiconductor device and method for manufacturing same

A semiconductor device comprising:

• a base member;
• a first stacked body placed on a front surface of the base member;
• and
• a second stacked body arranged with the first stacked body on the front surface of the base member,
• the first stacked body and the second stacked body each including a plurality of composite chips stacked in a first direction crossing the front surface of the base member, the plurality of composite chips each including a first semiconductor chip and a second semiconductor chip, a front surface of the first semiconductor chip being bonded to a front surface of the second semiconductor chip in each of the plurality of composite chips, the first semiconductor chip and the second semiconductor chip being placed alternately in the first direction in the first stacked body and the second stacked body,
• the first stacked body being connected so that a back surface of the first semiconductor chip faces the base member,
• the second stacked body being connected so that a back surface of the second semiconductor chip faces the base member.

A method for manufacturing a semiconductor device, comprising:

• forming a first wafer having a first surface and a second surface opposite to the first surface, the first wafer including first functional layers and second functional layers arranged alternately along the first surface;
• forming a second wafer having a first surface and a second surface opposite to the first surface, the second wafer including first functional layers and second functional layers arranged alternately along the first surface, the second wafer including a plurality of connection members placed on the second surface;
• forming a wafer-bonded body including the first wafer and the second wafer, the first surfaces of the first wafer and the second wafer being bonded together in the wafer-bonded body so that the first functional layer of the first wafer is bonded to the second functional layer of the second wafer, and the second functional layer of the first wafer is bonded to the first functional layer of the first wafer;
• and
• dividing the wafer-bonded body into a plurality of first stacked chips and a plurality of second stacked chips, the plurality of first stacked chips each including the first functional layer of the first wafer and the second functional layer of the second wafer, and the plurality of second stacked chips each including the first functional layer of the second wafer and the second functional layer of the first wafer.