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US 2019/0295980 A1Published application
Flip chip package utilizing trace bump trace interconnection
AssigneeMediatek Inc.
InventorsTzu-Hung Lin, Thomas Matthew Gregorich
Life of this patent
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Abstract
A flip chip package includes a substrate having a die attach surface; and a die mounted on the die attach surface with an active surface of the die facing the substrate, wherein the die is interconnected to the substrate via a plurality of copper pillar bumps on the active surface, wherein at least one of the plurality of copper pillar bumps has a bump width that is substantially equal to or smaller than a line width of a trace on the die attach surface of the substrate.
Claims20
A flip chip package, comprising:
- a substrate having a die attach surface;
- and
- a die mounted on the die attach surface with an active surface of the die facing the substrate, wherein the die is interconnected to the substrate through a plurality of conductive pillar bumps on the active surface, wherein at least one of the plurality of conductive pillar bumps has a bump width that is substantially equal to or smaller than a line width of a trace on the die attach surface of the substrate, and wherein the at least one of the plurality of conductive pillar bumps is directly jointed to the trace.
A flip chip package, comprising:
- a substrate having a die attach surface;
- and
- a die mounted on the die attach surface with an active surface of the die facing the substrate, wherein the die is interconnected to the substrate through a plurality of conductive pillar bumps on the active surface, wherein at least one of the plurality of conductive pillar bumps has a bump width that is substantially equal to or smaller than a line width of a trace on the die attach surface of the substrate, and wherein no substrate via is interposed between the at least one of the plurality of conductive pillar bumps and the trace.
Dependencies are inferred from the claim text.