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US 2019/0295976 A1Published application
Semiconductor fabrication apparatus and semiconductor fabrication method
AssigneeToshiba Memory Corporation
InventorKeiichi NIWA
Life of this patent
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Abstract
A semiconductor fabrication apparatus has a transfer plate having a plurality of transfer pins to transfer a flux onto a plurality of lands on a semiconductor substrate, a holder movable with the transfer plate, to hold the transfer plate, a positioning mechanism to perform positioning of the holder so that the plurality of lands and the respective transfer pins contact each other; and a pitch adjuster to adjust a pitch of at least part of the plurality of transfer pins.
Claims14
A semiconductor fabrication apparatus comprising:
- a transfer plate having a plurality of transfer pins to transfer a flux onto a plurality of lands on a semiconductor substrate;
- a holder movable with the transfer plate, to hold the transfer plate;
- a positioning mechanism to perform positioning of the holder so that the plurality of lands and the respective transfer pins contact each other;
- and
- a pitch adjuster to adjust a pitch of at least part of the plurality of transfer pins.
2 more elements
A semiconductor fabrication method comprising:
- adjusting a pitch of at least part of a plurality of transfer pins of a transfer plate, the plurality of transfer pins transferring a flux onto a plurality of lands on a semiconductor substrate;
- and
- contacting the plurality of transfer pins after the pitch is adjusted, with the corresponding one of the lands to transfer fluxes attached to tips of the plurality of transfer pins onto the respective plurality of lands.
Dependencies are inferred from the claim text.