Semiconductor chip, printed circuit board, multi-chip package including the semiconductor chip and printed circuit board, and method of manufacturing the multi-chip package
AssigneeSK hynix Inc.
InventorJin Ho BAEK
Life of this patent
Estimating the term…
Abstract
A multi-chip package may include a plurality of semiconductor chips and a printed circuit board (PCB). Each of the semiconductor chips may have an upper surface, a bottom surface, and a plurality of side surfaces. Circuit terminals may be arranged on the upper surface. A plurality of side bonding pads may be arranged on one or more selected side surface among the side surfaces. The semiconductor chips may be mounted on the PCB. The PCB may be configured to surround the selected side surface on which the side bonding pads may be arranged.
Claims20
A multi-chip package comprising:
- a plurality of semiconductor chips, wherein each chip comprises a bottom surface, an upper surface, and a plurality of side surfaces, the upper surface on which circuit terminals are arranged, and a plurality of side bonding pads arranged on one or more selected side surface among the side surfaces;
- and
- a printed circuit board (PCB) to which the semiconductor chips are mounted, the PCB configured to surround the selected side surfaces on which the side bonding pads are arranged.
19-29. (canceled)
A method of manufacturing a multi-chip package, the method comprising:
- preparing a wafer including a plurality of semiconductor chips and bonding pads arranged in an edge region outside scribe lanes between the semiconductor chips;
- cutting the wafer along the scribe lanes to singulate the semiconductor chips;
- forming side bonding pads corresponding to the bonding pads on a selected side surface of each of the semiconductor chips;
- forming a redistribution layer to electrically connect the bonding pads with the side bonding pads;
- and
- mounting the semiconductor chips on a printed circuit board (PCB) to electrically connect the side bonding pads with electrode terminals of the PCB.
Dependencies are inferred from the claim text.