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US 2019/0295966 A1Published application
Interconnect core
AssigneeIntel Corporation
InventorJackson Chung Peng Kong
Life of this patent
Estimating the term…
Abstract
A device and method of utilizing conductive thread interconnect cores. Substrates using conductive thread interconnect cores are shown. Methods of creating a conductive thread interconnect core are shown.
Claims26
-25. (canceled)
A substrate package, comprising:
- a substrate core layer including:
- a dielectric;
- and
- a set of electrically conductive threads;
- a first set of substrate routing layers attached to a first side of the substrate core layer;
- and
- a second set of substrate routing layers attached to a second side of the substrate core, the second side of the substrate core opposite the first side of the substrate core.
4 more elements
A semiconductor device, comprising:
- a substrate including a substrate core;
- wherein the substrate core includes:
- a dielectric;
- and
- a set of conductive threads;
- a first semiconductor die attached to a first side of the substrate;
- and
- a ball grid array attached to a second side of the substrate.
5 more elements
A method comprising:
- configuring a set of conductive threads;
- encapsulating the set of conductive threads into an encapsulated block of conductive threads using a molding process;
- and
- cutting the encapsulated block of conductive threads into a set of conductive thread panels with a predetermined thickness.
1 more element
Dependencies are inferred from the claim text.