Direct bonded heterogeneous integration packaging structures

An integrated circuit packaging structure free of an interposer layer, the integrated circuit packaging structure comprising:

• a packaging substrate comprising first and second opposing surfaces, a pedestal provided in the first surface;
• at least one bridge having one end disposed adjacent to the pedestal;
• and
• at least two chips in a side by side arrangement overlying the at least one bridge and the packaging substrate, wherein the at least one bridge underlies peripheral edges of the at least two chips in the side by side arrangement, the at least two chips comprising a plurality of electric connections coupled to corresponding electrical connections on the bridge and on the packaging substrate, wherein the corresponding electrical connections on the packaging substrate are adjacent to another end of the bridge and on the pedestal, wherein the corresponding electrical connections on the pedestal.

A process for forming an integrated circuit packaging structure comprising:

• providing a packaging substrate after final layer buildup comprising first and second opposing surfaces;
• forming a trench in the first surface of the packaging substrate, wherein the first surface includes a plurality of electrical connections;
• coupling at least two chips in a side by side arrangement having electrical connections on surfaces thereof to corresponding electrical connections on a surface of at least one bridge, wherein the at least one bridge underlies peripheral edges of the at least two chips in the side by side arrangement;
• placing the bridge in the trench and electrically coupling the at least two chips to the plurality of electrical connections on the first surface of the packaging substrate.