Semiconductor Device And Method For Manufacturing Same
AssigneeMicron Technology, Inc.
InventorKanta Saino
Life of this patent
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Abstract
A semiconductor device includes a first well and a second well provided within a semiconductor substrate, an isolation region disposed between the first well and the second well within the semiconductor substrate, a first wiring disposed on the first well, a second wiring disposed on the second well, a concave third wiring disposed on the isolation region, a buried insulating film disposed on the third wiring so as to fill the concave portion thereof, a plurality of fourth wirings disposed on the buried insulating film, and a contact plug disposed so as to electrically connect to at least one of the first and second wells.
Claims8
1-19. (canceled)
A semiconductor device comprising:
- a first well within semiconductor material;
- a second well within the semiconductor material;
- a dielectric isolation region within the semiconductor material between the first and second well;
- a wiring above and physically contacting the isolation region, the wiring including a seam above the isolation region;
- and
- an insulating film over the wiring filling the seam of the wiring.
A semiconductor device comprising:
- a first well within semiconductor material;
- a second well within the semiconductor material;
- a dielectric isolation region within the semiconductor material between the first and second well;
- a wiring including a seam over the isolation region;
- an insulating film over the wiring filling the seam of the wiring;
- and
- another insulating film between the wiring and the insulating film, the another insulating film being in the seam.
A semiconductor device comprising:
- a first well within semiconductor material;
- a second well within the semiconductor material;
- a dielectric isolation region within the semiconductor material between the first and second well;
- a wiring including a seam over the isolation region, the wiring comprising a bit line of memory circuitry;
- and
- an insulating film over the wiring filling the seam of the wiring.
Dependencies are inferred from the claim text.