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US 2019/0295939 A1Published application
Electronic device having inverted lead pins
AssigneeTexas Instruments Incorporated
InventorsCHANG-YEN KO, JK HO
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Abstract
An electronic device (e.g., integrated circuit) and method of making the electronic device is provided that reduces a strength of an electric field generated outside a package of the electronic device proximate to the low voltage lead pins. The electronic device includes a low voltage side and a high voltage side. The low voltage side includes a low voltage die attached to a low voltage die attach pad. Similarly, the high voltage side includes a high voltage die attached to a high voltage die attach pad. Lead pins are attached to each of the low and high voltage attach pads and extend out from a package of the electronic device in an inverted direction.
Claims20
An electronic device, comprising:
- a package having a longitudinal center line, a mounting portion on one side of the longitudinal center line and a non-mounting portion on an opposite side of the longitudinal center line;
- a low voltage die attach pad embedded in a non-mounting portion of the package, the low voltage die attach pad having a first side facing toward the longitudinal center line and a second side facing away from the longitudinal center line;
- a low voltage die attached to the first side of the low voltage die attach pad;
- a plurality of inverted low voltage lead pins extending from the package in a direction toward the mounting portion and away from the non-mounting portion of the package;
- a high voltage die attach pad embedded in the non-mounting portion of the package, the high voltage die attach pad having a first side facing toward the longitudinal center line and a second side facing away from the longitudinal center line;
- a high voltage die attached to the first side of the high voltage die attach pad;
- and
- a plurality of inverted high voltage lead pins extending from the package in the direction toward the mounting portion and away from the non-mounting portion of the package.
5 more elements
An integrated circuit, comprising:
- a package having a longitudinal center line extending from a low voltage side of the package to a high voltage side, the package including a mounting portion on one side of the longitudinal center line and a non-mounting portion on an opposite side of the longitudinal center line;
- a low voltage die attach pad embedded in the package, the low voltage die attach pad having a first side facing toward the longitudinal center line toward the mounting portion of the package and a second side facing away from the longitudinal center line toward the non-mounting portion of the package, the low voltage die attach pad being displaced at a first offset from the longitudinal center line toward the non-mounting portion of the package;
- a low voltage die attached to the first side of the low voltage die attach pad;
- a plurality of inverted low voltage lead pins extending from the package in a direction away from the longitudinal center line and opposite a direction of the first offset;
- a high voltage die attach pad embedded in the package, the high voltage die attach pad having a first side facing toward the longitudinal center line toward the mounting portion of the package and a second side facing away from the longitudinal center line toward the non-mounting portion of the package, the high voltage die attach pad being displaced at the first offset from the longitudinal center line toward the non-mounting portion of the package;
- a high voltage die attached to the first side of the high voltage die attach pad;
- and
- a plurality of inverted high voltage lead pins extending from the package in the direction away from the longitudinal center line and opposite the direction of the first offset.
5 more elements
A method comprising:
- attaching a low voltage die to a low voltage die attach pad and a high voltage die to a high voltage die attach pad;
- attaching a first end of at least one low voltage lead pin to the low voltage die attach pad and a first end of at least one high voltage lead pin to the high voltage die attach pad;
- placing the low voltage die and the high voltage die in cavities defined in a package body of an integrated circuit;
- encapsulating the low voltage die, the high voltage die, the low voltage die attach pad, and the high voltage die attach pad in a package of the integrated circuit, wherein the low voltage die attach pad and the high voltage die attach pad are displaced from a longitudinal center line of a package of the integrated circuit at a first offset in a direction toward a non-mounting portion of the package;
- and
- bending a second end of the at least one low voltage lead pin and a second end of the at least one high voltage lead pin disposed outside the package in a direction away from the longitudinal center line of the package and opposite the direction of the first offset.
3 more elements
Dependencies are inferred from the claim text.