Leadframe package using selectively pre-plated leadframe
AssigneeSTMicroelectronics S.r.l.
InventorPaolo CREMA
Life of this patent
Estimating the term…
Abstract
The present disclosure is directed to a leadframe package with a surface mounted semiconductor die coupled to leads of the leadframe package through wire bonding. The leads are partially exposed outside the package and configured to couple to another structure, like a printed circuit board (PCB). The exposed portions, namely outer segments, of the leads include a plating or coating layer of a material that enhances the solder wettability of the leads to the PCB through solder bonding. The enclosed portions, namely inner segments, of the leads do not include the plating layer of the outer segment and, thus, include a different surface material or surface finish.
Claims21
A device, comprising:
- a semiconductor die overlaying a die pad;
- a molding material encapsulating the semiconductor die;
- and
- a lead having a first segment and a second segment, the first segment including a first plating material different than a surface material of the second segment and a surface material of the die pad, the first plating material partially encapsulated within the molding material and partially exposed outside the molding material, and the second segment being encapsulated within the molding material.
A device, comprising:
- a semiconductor die overlaying a die pad;
- a molding material encapsulating the semiconductor die;
- and
- a lead having a first segment and a second segment, the first segment including a first surface and a second surface exposed outside the molding material, the first surface including a first surface material and the second surface including a second surface material at a center of the second surface and the second segment including a third surface material, the second surface material and the third surface material both being different than the first surface material, the first surface material and the second surface material both partially encapsulated by the molding material.
18-20. (canceled)
A semiconductor package, comprising:
- a semiconductor die;
- an encapsulation layer encapsulating the semiconductor die;
- and
- a lead coupled to the semiconductor die, the lead having a first surface material and a second surface material exposed from the encapsulation layer, the first surface material being different from the second surface material, the lead being substantially coplanar with a surface of the encapsulation layer.
Dependencies are inferred from the claim text.